JPH084310Y2 - Ｉｃカード - Google Patents

Ｉｃカード

Info

Publication number
JPH084310Y2
JPH084310Y2 JP1988096171U JP9617188U JPH084310Y2 JP H084310 Y2 JPH084310 Y2 JP H084310Y2 JP 1988096171 U JP1988096171 U JP 1988096171U JP 9617188 U JP9617188 U JP 9617188U JP H084310 Y2 JPH084310 Y2 JP H084310Y2
Authority
JP
Japan
Prior art keywords
substrate
resin mold
recess
module
mold portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988096171U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0217381U (OSRAM
Inventor
佳明 肥田
昌夫 後上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP1988096171U priority Critical patent/JPH084310Y2/ja
Publication of JPH0217381U publication Critical patent/JPH0217381U/ja
Application granted granted Critical
Publication of JPH084310Y2 publication Critical patent/JPH084310Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
JP1988096171U 1988-07-20 1988-07-20 Ｉｃカード Expired - Lifetime JPH084310Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988096171U JPH084310Y2 (ja) 1988-07-20 1988-07-20 Ｉｃカード

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988096171U JPH084310Y2 (ja) 1988-07-20 1988-07-20 Ｉｃカード

Publications (2)

Publication Number Publication Date
JPH0217381U JPH0217381U (OSRAM) 1990-02-05
JPH084310Y2 true JPH084310Y2 (ja) 1996-02-07

Family

ID=31321008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988096171U Expired - Lifetime JPH084310Y2 (ja) 1988-07-20 1988-07-20 Ｉｃカード

Country Status (1)

Country Link
JP (1) JPH084310Y2 (OSRAM)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6146655U (ja) * 1984-08-31 1986-03-28 カシオ計算機株式会社 Ｉｃカ−ド
JPS6253895A (ja) * 1985-08-31 1987-03-09 凸版印刷株式会社 Ｉｃカ−ドの製造方法
JPS6296847U (OSRAM) * 1985-12-09 1987-06-20
JPS62187780U (OSRAM) * 1986-05-19 1987-11-30
JPS6391294A (ja) * 1986-10-06 1988-04-21 松下電器産業株式会社 Ｉｃカ−ド
JPS63233892A (ja) * 1987-03-23 1988-09-29 松下電子工業株式会社 Ｉｃカ−ド

Also Published As

Publication number Publication date
JPH0217381U (OSRAM) 1990-02-05

Similar Documents

Publication Publication Date Title
KR102468554B1 (ko) 지문 인식 모듈 및 지문 인식 모듈의 제조 방법
JPH022100A (ja) Ｉｃカードの構造
US4943708A (en) Data device module having locking groove
JPS6347265B2 (OSRAM)
JPH084310Y2 (ja) Ｉｃカード
JPS63185688A (ja) Ｉｃカ−ドの製造方法
JPH0230598A (ja) Ｉｃモジュールおよびｉｃカード
JPH05151424A (ja) 集積回路トークン
JP2510669B2 (ja) Ｉｃカ―ド
JPH02188298A (ja) Ｉｃモジュールおよびｉｃカード
JP2510694B2 (ja) Ｉｃカ―ド
JP2578443B2 (ja) Ｉｃカードおよびｉｃカード用ｉｃモジュール
JPH02188299A (ja) Ｉｃモジュールおよびｉｃカード
JPH11216974A (ja) 複合型ｉｃカード及びその製造方法
JPH01263090A (ja) Ｉｃカード
JP2588548B2 (ja) Ｉｃカード
JP3386166B2 (ja) Ｉｃカード
JP2001229360A (ja) Ｉｃカード
JPH022092A (ja) Ｉｃカード
JP2664730B2 (ja) Ｉｃカードおよびｉｃモジュール
JP2950832B2 (ja) Ｉｃカードおよびｉｃモジュール
JP2578443C (OSRAM)
JPH01210394A (ja) 集積回路装置
JP2004046634A (ja) 非接触型ｉｃカード
JP2510520B2 (ja) Ｉｃカ−ドおよびｉｃカ−ド用ｉｃモジユ−ル