JPH083009Y2 - 半導体素子収納用パッケージ - Google Patents

半導体素子収納用パッケージ

Info

Publication number
JPH083009Y2
JPH083009Y2 JP1989125453U JP12545389U JPH083009Y2 JP H083009 Y2 JPH083009 Y2 JP H083009Y2 JP 1989125453 U JP1989125453 U JP 1989125453U JP 12545389 U JP12545389 U JP 12545389U JP H083009 Y2 JPH083009 Y2 JP H083009Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
metal
metal layer
insulating frame
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989125453U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0363939U (US06252093-20010626-C00008.png
Inventor
敏幸 千歳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1989125453U priority Critical patent/JPH083009Y2/ja
Publication of JPH0363939U publication Critical patent/JPH0363939U/ja
Application granted granted Critical
Publication of JPH083009Y2 publication Critical patent/JPH083009Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
JP1989125453U 1989-10-26 1989-10-26 半導体素子収納用パッケージ Expired - Lifetime JPH083009Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989125453U JPH083009Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989125453U JPH083009Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0363939U JPH0363939U (US06252093-20010626-C00008.png) 1991-06-21
JPH083009Y2 true JPH083009Y2 (ja) 1996-01-29

Family

ID=31673323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989125453U Expired - Lifetime JPH083009Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JPH083009Y2 (US06252093-20010626-C00008.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014117332A (ja) * 2012-12-13 2014-06-30 Daiichi Rubber Kk 履物、ブーツ及び長靴

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4557406B2 (ja) * 2000-10-27 2010-10-06 京セラ株式会社 圧力検出装置用パッケージ
JP2003007885A (ja) * 2001-06-26 2003-01-10 Kyocera Corp 半導体素子収納用パッケージ
JP5074912B2 (ja) * 2007-12-17 2012-11-14 グンゼ株式会社 立体編み部付き衣類

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014117332A (ja) * 2012-12-13 2014-06-30 Daiichi Rubber Kk 履物、ブーツ及び長靴

Also Published As

Publication number Publication date
JPH0363939U (US06252093-20010626-C00008.png) 1991-06-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term