JPH08236498A - Method of air knife drying - Google Patents

Method of air knife drying

Info

Publication number
JPH08236498A
JPH08236498A JP4018995A JP4018995A JPH08236498A JP H08236498 A JPH08236498 A JP H08236498A JP 4018995 A JP4018995 A JP 4018995A JP 4018995 A JP4018995 A JP 4018995A JP H08236498 A JPH08236498 A JP H08236498A
Authority
JP
Japan
Prior art keywords
air knife
drying
glass substrate
rinse liquid
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4018995A
Other languages
Japanese (ja)
Other versions
JP2699911B2 (en
Inventor
Shigeru Kimura
茂 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP7040189A priority Critical patent/JP2699911B2/en
Publication of JPH08236498A publication Critical patent/JPH08236498A/en
Application granted granted Critical
Publication of JP2699911B2 publication Critical patent/JP2699911B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE: To prevent a water mark generation even on a glass substrate with repellency when rinsing liquid for cleaning in a single wafer processing, for wet etching or for resist peeling is dried with an air knife. CONSTITUTION: A slit-like rinsing shower 4 is placed just before an air knife 3 and sprinkles rinsing liquid 8 in the direction where a glass substrate 1 is moved. Through the step when the glass substrate 1 is dried by the air knife, the glass substrate 1 is uniformly wetted, waterdrop generation is prevented and water mark generation after the air knife drying is prevented.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、アクティブマトリクス
型液晶表示装置に用いられる薄膜トランジスタ基板など
の製造工程での枚葉式の洗浄,ウェットエッチング,レ
ジスト剥離等のリンス液のエアナイフ乾燥方法に関し、
特にウォータマークなどの汚染が残り基板欠陥が生じる
ことなくリンス液が乾燥できる方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for drying an air knife of a rinse liquid such as single-wafer cleaning, wet etching and resist stripping in a manufacturing process of a thin film transistor substrate used for an active matrix type liquid crystal display device,
In particular, the present invention relates to a method for drying a rinse liquid without causing contamination such as watermarks and causing substrate defects.

【0002】[0002]

【従来の技術】従来の処理方法の例を図2に示す。図2
(a)は装置全体の構成例、図2(b)及び(c)は、
リンス槽の具体例の側面図及び上面図である。図2
(a)において、薄膜トランジスタ基板等のガラス基板
1は、ローダ100からアンローダ104まで自動的に
順次に搬送される。ローダ100より搬出されたガラス
基板1は、処理槽101で、洗浄,ウェットエッチン
グ,レジスト剥離等の処理が行われ、次にリンス槽10
2に搬送され純水等のリンスが行われる。そして乾燥槽
103に搬送され、高圧空気,高圧不活性ガス等を吹き
付けるエアナイフにより乾燥され、アンローダ104に
搬送される。
2. Description of the Related Art An example of a conventional processing method is shown in FIG. Figure 2
(A) is a configuration example of the entire device, and FIGS. 2 (b) and (c) are
It is a side view and a top view of a concrete example of a rinse tank. Figure 2
In (a), the glass substrate 1 such as a thin film transistor substrate is automatically and sequentially conveyed from the loader 100 to the unloader 104. The glass substrate 1 carried out from the loader 100 is subjected to processing such as cleaning, wet etching, and resist stripping in the processing tank 101, and then the rinse tank 10
It is conveyed to 2 and rinsed with pure water or the like. Then, it is transported to the drying tank 103, dried by an air knife that blows high-pressure air, high-pressure inert gas, etc., and transported to the unloader 104.

【0003】図2(b)及び(c)において、ガラス基
板1は、搬送ローラ5の上を図中の左側から右側に搬送
される。リンス槽102では、ガラス基板1は、リンス
液シャワー7によりリンス液を吹き付けられ、図2
(a)に示す処理槽101の処理液を洗い流す。続い
て、ガラス基板1は、乾燥槽103に搬送されるとエア
ナイフ3により高圧空気、高圧不活性ガス等を吹き付け
られ、リンス液9を吹き飛ばし、乾燥処理が行われる。
そして、ガラス基板1は、アンローダ104に搬送され
る。
In FIGS. 2B and 2C, the glass substrate 1 is conveyed on the conveying roller 5 from the left side to the right side in the figure. In the rinse tank 102, the glass substrate 1 is sprayed with the rinse liquid by the rinse liquid shower 7, as shown in FIG.
The treatment liquid in the treatment tank 101 shown in (a) is washed away. Subsequently, when the glass substrate 1 is conveyed to the drying tank 103, high pressure air, high pressure inert gas and the like are blown by the air knife 3, the rinse liquid 9 is blown off, and a drying process is performed.
Then, the glass substrate 1 is conveyed to the unloader 104.

【0004】従来の技術の他の例を図3に示す。乾燥槽
103のエアナイフ3の直前にピンホール式リンス液シ
ャワー11等を設け、更にエアナイフ乾燥する直前にガ
ラス基板1を傾斜搬送させる構成となっている(例え
ば、特開平4−337637号公報)。
Another example of the conventional technique is shown in FIG. A pinhole type rinse liquid shower 11 or the like is provided immediately before the air knife 3 in the drying tank 103, and the glass substrate 1 is inclined and conveyed immediately before the air knife is dried (for example, Japanese Patent Laid-Open No. 4-337637).

【0005】[0005]

【発明が解決しようとする課題】図2に示す従来のエア
ナイフ乾燥方法では、図2(b)に示すようにリンス槽
102のシャワー7と乾燥槽103のエアナイフ3との
間にはある程度の距離が有り、ガラス基板1の最表面に
揆水性の膜が露出している場合、リンス液例えば純水は
部分的にはじかれて水玉6を発生してしまう。その状態
でエアナイフ乾燥されると、図2(c)に示したように
乾燥のあとにウォータマーク10が生じる問題点があっ
た。
In the conventional air knife drying method shown in FIG. 2, a certain distance is provided between the shower 7 in the rinse tank 102 and the air knife 3 in the drying tank 103 as shown in FIG. 2 (b). However, when the water-repellent film is exposed on the outermost surface of the glass substrate 1, the rinse liquid, for example, pure water, is partially repelled to generate water drops 6. When air knife drying is performed in this state, there is a problem that the watermark 10 is generated after the drying as shown in FIG.

【0006】図3に示す従来の他のエアナイフ乾燥方法
では、ガラス基板1が水平搬送から傾斜搬送に変わる際
にガラス基板1が持ち上がり搬送不良が生じる問題点が
あり、更にガラス基板1の最表面に露出している膜の揆
水性が強い場合、エアナイフ乾燥の直前に水玉を発生し
てしまい、図2の従来例と同様にウォータマークが生じ
る問題点があった。
In the other conventional air knife drying method shown in FIG. 3, there is a problem that the glass substrate 1 is lifted up when the glass substrate 1 is changed from the horizontal conveyance to the inclined conveyance, and the conveyance failure occurs. When the water repellent property of the exposed film is strong, polka dots are generated immediately before the air knife drying, and there is a problem that a watermark is generated as in the conventional example of FIG.

【0007】[0007]

【課題を解決するための手段】本発明のエアナイフ乾燥
方法はエアナイフの直前にガラス基板とのクリアランス
ギャップを小さくしたスリット状リンス液シャワーを設
け、リンス液を搬送方向に吐出させ、エアナイフ乾燥の
直前までガラス基板を一様にリンス液で覆うようにした
ことを特徴とする。また、エアナイフの前後を隔離し、
ミストの再付着を防止してエアナイフ乾燥を行うことを
特徴とする。
In the air knife drying method of the present invention, a slit-like rinse liquid shower having a small clearance gap with a glass substrate is provided immediately before the air knife, and the rinse liquid is discharged in the conveying direction, and immediately before the air knife drying. The glass substrate is evenly covered with a rinse liquid. Also, isolate the front and back of the air knife,
The feature is that air knife drying is performed while preventing reattachment of mist.

【0008】[0008]

【作用】本発明によれば、ガラス基板の最表面に強い揆
水性を示す膜がある場合においても、エアナイフの直前
で水玉が発生することを抑えることができ、ウォータマ
ークの発生も防止できる。更に従来の技術の他の例の問
題点である搬送不良の発生も防止できる。
According to the present invention, even if the outermost surface of the glass substrate has a film exhibiting a strong water repellent property, it is possible to suppress the generation of polka dots immediately before the air knife and prevent the formation of watermarks. Further, it is possible to prevent the occurrence of defective conveyance, which is a problem of another example of the conventional technique.

【0009】[0009]

【実施例】次に本発明について図面を参照にして説明す
る。図1(a),(b)は本発明の一実施例を示す側面
図と上面図である。図において、102はリンス槽、1
03は乾燥槽、104はアンローダ、2ははね返り隔離
板、4はスリット状リンス液シャワー、8はスリット状
リンス液シャワー4から吐出されたリンス液である。乾
燥槽の部分以外は図2の従来例と同じである。乾燥槽1
03にはスリット状リンス液シャワー4がエアナイフ3
の直前の位置に設けられている。乾燥槽103のスリッ
ト状リンス液シャワー4は、ガラス基板1とのクリアラ
ンスギャップを小さくし、ガラス基板1の搬送方向にリ
ンス液8が吐出されるように設置する。そしてエアナイ
フ3のエアがガラス基板1に吹きかかる部分まで、ガラ
ス基板1の表面をリンス液8で一様に覆う様にスリット
状リンス液シャワー4の流量を調整する。更にエアナイ
フ3には、リンス液8のはね返りミストがガラス基板1
に再付着することを防止するために、はね返り隔離板2
が設置されている。
The present invention will be described below with reference to the drawings. 1A and 1B are a side view and a top view showing an embodiment of the present invention. In the figure, 102 is a rinse tank, 1
Reference numeral 03 is a drying tank, 104 is an unloader, 2 is a rebound separator, 4 is a slit-like rinse solution shower, and 8 is a rinse solution discharged from the slit-like rinse solution shower 4. Except for the portion of the drying tank, it is the same as the conventional example of FIG. Drying tank 1
In 03, the slit-like rinse shower 4 is the air knife 3
It is provided in the position just before. The slit-shaped rinse liquid shower 4 of the drying tank 103 is installed so that the clearance gap with the glass substrate 1 is made small and the rinse liquid 8 is discharged in the transport direction of the glass substrate 1. Then, the flow rate of the slit-shaped rinse liquid shower 4 is adjusted so that the surface of the glass substrate 1 is uniformly covered with the rinse liquid 8 up to the portion where the air of the air knife 3 is blown onto the glass substrate 1. Further, the air knife 3 has a splash mist of the rinse liquid 8 on the glass substrate 1.
Rebound separator 2 to prevent reattachment to
Is installed.

【0010】これらによりガラス基板1の最表面の膜が
強い疏水性を示し、リンス槽102から搬出された時点
で水玉6が発生している場合においても、エアナイフ3
で高圧空気や高圧吹活性ガスを吹き付ける時点では、ガ
ラス基板1の最表面はリンス液8で覆れ、水玉6の発生
が無い状態でエアナイフ乾燥が行え、ウォータマークの
発生が防止できる。更にはね返り隔離板2によりリンス
液8のガラス基板1への再付着も防止できる。
Due to these, the film on the outermost surface of the glass substrate 1 exhibits strong hydrophobicity, and even when the water drops 6 are generated at the time of being discharged from the rinse tank 102, the air knife 3
At the time when the high pressure air or the high pressure blowing active gas is blown, the outermost surface of the glass substrate 1 is covered with the rinse liquid 8 and the air knife drying can be performed without the formation of the water drops 6 and the generation of the watermark can be prevented. Further, the rebound separator 2 can prevent the rinse liquid 8 from reattaching to the glass substrate 1.

【0011】[0011]

【発明の効果】以上説明したように本発明は、エアナイ
フ乾燥される時点では、リンス液でガラス基板の表面を
均一に覆い、水玉の発生を抑制し、ウォータマークの発
生を防止したので、製品の品質及び歩留りの向上がはか
れる。
As described above, according to the present invention, at the time of air knife drying, the surface of the glass substrate is uniformly covered with the rinse liquid to suppress the generation of polka dots and prevent the formation of watermarks. The quality and yield of the product can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】(a),(b)は本発明の一実施例を示す側面
図と上面図である。
1A and 1B are a side view and a top view showing an embodiment of the present invention.

【図2】従来の処理方法の例を示す図で、(a)は装置
全体の構成例,(b),(c)はリンス槽・乾燥槽の側
面図と上面図である。
FIG. 2 is a diagram showing an example of a conventional processing method, (a) is a configuration example of the entire apparatus, and (b) and (c) are a side view and a top view of a rinse tank / drying tank.

【図3】従来の処理方法の他の例を示す図である。FIG. 3 is a diagram showing another example of a conventional processing method.

【符号の説明】[Explanation of symbols]

100 ローダ 101 処理槽 102 リンス槽 103 乾燥槽 104 アンローダ 1 ガラス基板 2 はね返り隔離板 3 エアナイフ 4 スイット状リンス液シャワー 5 搬送ローラ 6 水玉 7 リンス液シャワー 8,9 リンス液 10 ウォータマーク 100 Loader 101 Processing Tank 102 Rinsing Tank 103 Drying Tank 104 Unloader 1 Glass Substrate 2 Bounce Separator 3 Air Knife 4 Sweat-like Rinse Liquid Shower 5 Conveying Roller 6 Water Drop 7 Rinse Liquid Shower 8, 9 Rinse Liquid 10 Watermark

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 枚葉式で基板の洗浄,ウェットエッチン
グ,レジスト剥離等を行うリンス液を空気又は不活性ガ
ス等によりエアナイフ乾燥を行う方法において、エアナ
イフ乾燥の直前まで基板が一様にリンス液で覆われてい
ることを特徴とするエアナイフ乾燥方法。
1. A method in which a rinsing solution for cleaning a substrate, wet etching, resist stripping, etc. by a single wafer method is air knife dried with air or an inert gas, etc., and the substrate is uniformly rinsed until just before the air knife drying. An air knife drying method characterized by being covered with.
【請求項2】 エアナイフの直前の位置にスリット状リ
ンス液シャワーを設け、前記基板の進行方向にリンス液
を吐出させることを特徴とする請求項1記載のエアナイ
フ乾燥方法。
2. A method of drying an air knife according to claim 1, wherein a slit-shaped rinse liquid shower is provided immediately before the air knife, and the rinse liquid is discharged in a traveling direction of the substrate.
【請求項3】 エアナイフ乾燥時のミストがエアナイフ
乾燥後に再付着することを防止するためにエアナイフ前
後の隔離することを特徴とする請求項1記載のエアナイ
フ乾燥方法。
3. The method of drying an air knife according to claim 1, wherein the mist at the time of drying the air knife is separated before and after the air knife to prevent re-adhesion after the air knife is dried.
JP7040189A 1995-02-28 1995-02-28 Air knife drying method Expired - Fee Related JP2699911B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7040189A JP2699911B2 (en) 1995-02-28 1995-02-28 Air knife drying method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7040189A JP2699911B2 (en) 1995-02-28 1995-02-28 Air knife drying method

Publications (2)

Publication Number Publication Date
JPH08236498A true JPH08236498A (en) 1996-09-13
JP2699911B2 JP2699911B2 (en) 1998-01-19

Family

ID=12573838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7040189A Expired - Fee Related JP2699911B2 (en) 1995-02-28 1995-02-28 Air knife drying method

Country Status (1)

Country Link
JP (1) JP2699911B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010035506A (en) * 2001-02-22 2001-05-07 신원호 Device for dry of LCD panel
WO2002073672A1 (en) * 2001-03-14 2002-09-19 Sumitomo Precision Products Co., Ltd. Substrate treating device
JP2004095926A (en) * 2002-09-02 2004-03-25 Dainippon Screen Mfg Co Ltd Substrate treatment equipment
JP2006247541A (en) * 2005-03-11 2006-09-21 Toray Ind Inc Liquid removing device
DE102006034309A1 (en) * 2006-07-21 2008-01-31 Ic-Automation Gmbh Device for cleaning a flat object
JP2014069127A (en) * 2012-09-28 2014-04-21 Dainippon Screen Mfg Co Ltd Substrate cleaning device
CN107401914A (en) * 2017-07-20 2017-11-28 郑州旭飞光电科技有限公司 Air knife drying box
CN108109946A (en) * 2018-01-16 2018-06-01 昆山成功环保科技有限公司 A kind of etching apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63157928U (en) * 1987-04-03 1988-10-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63157928U (en) * 1987-04-03 1988-10-17

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010035506A (en) * 2001-02-22 2001-05-07 신원호 Device for dry of LCD panel
WO2002073672A1 (en) * 2001-03-14 2002-09-19 Sumitomo Precision Products Co., Ltd. Substrate treating device
JP2004095926A (en) * 2002-09-02 2004-03-25 Dainippon Screen Mfg Co Ltd Substrate treatment equipment
JP2006247541A (en) * 2005-03-11 2006-09-21 Toray Ind Inc Liquid removing device
DE102006034309A1 (en) * 2006-07-21 2008-01-31 Ic-Automation Gmbh Device for cleaning a flat object
JP2014069127A (en) * 2012-09-28 2014-04-21 Dainippon Screen Mfg Co Ltd Substrate cleaning device
CN107401914A (en) * 2017-07-20 2017-11-28 郑州旭飞光电科技有限公司 Air knife drying box
CN108109946A (en) * 2018-01-16 2018-06-01 昆山成功环保科技有限公司 A kind of etching apparatus

Also Published As

Publication number Publication date
JP2699911B2 (en) 1998-01-19

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