JP2699911B2 - Air knife drying method - Google Patents
Air knife drying methodInfo
- Publication number
- JP2699911B2 JP2699911B2 JP7040189A JP4018995A JP2699911B2 JP 2699911 B2 JP2699911 B2 JP 2699911B2 JP 7040189 A JP7040189 A JP 7040189A JP 4018995 A JP4018995 A JP 4018995A JP 2699911 B2 JP2699911 B2 JP 2699911B2
- Authority
- JP
- Japan
- Prior art keywords
- air knife
- rinsing liquid
- drying
- glass substrate
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、アクティブマトリクス
型液晶表示装置に用いられる薄膜トランジスタ基板など
の製造工程での枚葉式の洗浄,ウェットエッチング,レ
ジスト剥離等のリンス液のエアナイフ乾燥方法に関し、
特にウォータマークなどの汚染が残り基板欠陥が生じる
ことなくリンス液が乾燥できる方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of drying a rinse liquid such as a single wafer type cleaning, wet etching and resist stripping in an air knife in a manufacturing process of a thin film transistor substrate used in an active matrix type liquid crystal display device.
In particular, the present invention relates to a method for drying a rinsing liquid without causing contamination such as a watermark and leaving a substrate defect.
【0002】[0002]
【従来の技術】従来の処理方法の例を図2に示す。図2
(a)は装置全体の構成例、図2(b)及び(c)は、
リンス槽の具体例の側面図及び上面図である。図2
(a)において、薄膜トランジスタ基板等のガラス基板
1は、ローダ100からアンローダ104まで自動的に
順次に搬送される。ローダ100より搬出されたガラス
基板1は、処理槽101で、洗浄,ウェットエッチン
グ,レジスト剥離等の処理が行われ、次にリンス槽10
2に搬送され純水等のリンスが行われる。そして乾燥槽
103に搬送され、高圧空気,高圧不活性ガス等を吹き
付けるエアナイフにより乾燥され、アンローダ104に
搬送される。2. Description of the Related Art An example of a conventional processing method is shown in FIG. FIG.
(A) is a configuration example of the entire apparatus, and (b) and (c) of FIG.
It is the side view and top view of the specific example of a rinse tank. FIG.
1A, a glass substrate 1 such as a thin film transistor substrate is automatically and sequentially conveyed from a loader 100 to an unloader 104. The glass substrate 1 carried out from the loader 100 is subjected to processing such as cleaning, wet etching, and resist stripping in a processing tank 101, and then the rinsing tank 10.
2 and rinsed with pure water or the like. Then, it is conveyed to a drying tank 103, dried by an air knife that blows high-pressure air, high-pressure inert gas, or the like, and conveyed to an unloader 104.
【0003】図2(b)及び(c)において、ガラス基
板1は、搬送ローラ5の上を図中の左側から右側に搬送
される。リンス槽102では、ガラス基板1は、リンス
液シャワー7によりリンス液を吹き付けられ、図2
(a)に示す処理槽101の処理液を洗い流す。続い
て、ガラス基板1は、乾燥槽103に搬送されるとエア
ナイフ3により高圧空気、高圧不活性ガス等を吹き付け
られ、リンス液9を吹き飛ばし、乾燥処理が行われる。
そして、ガラス基板1は、アンローダ104に搬送され
る。In FIGS. 2 (b) and 2 (c), the glass substrate 1 is transported on a transport roller 5 from the left side to the right side in the figure. In the rinsing bath 102, the glass substrate 1 is sprayed with a rinsing liquid by a rinsing liquid shower 7,
The processing liquid in the processing tank 101 shown in FIG. Subsequently, when the glass substrate 1 is conveyed to the drying tank 103, high-pressure air, high-pressure inert gas or the like is blown by the air knife 3 to blow off the rinsing liquid 9, and a drying process is performed.
Then, the glass substrate 1 is transported to the unloader 104.
【0004】従来の技術の他の例を図3に示す。乾燥槽
103のエアナイフ3の直前にピンホール式リンス液シ
ャワー11等を設け、更にエアナイフ乾燥する直前にガ
ラス基板1を傾斜搬送させる構成となっている(例え
ば、特開平4−337637号公報)。Another example of the prior art is shown in FIG. A pinhole type rinsing liquid shower 11 or the like is provided immediately before the air knife 3 in the drying tank 103, and the glass substrate 1 is tilted and conveyed immediately before air knife drying (for example, JP-A-4-337637).
【0005】[0005]
【発明が解決しようとする課題】図2に示す従来のエア
ナイフ乾燥方法では、図2(b)に示すようにリンス槽
102のシャワー7と乾燥槽103のエアナイフ3との
間にはある程度の距離が有り、ガラス基板1の最表面に
揆水性の膜が露出している場合、リンス液例えば純水は
部分的にはじかれて水玉6を発生してしまう。その状態
でエアナイフ乾燥されると、図2(c)に示したように
乾燥のあとにウォータマーク10が生じる問題点があっ
た。In the conventional air knife drying method shown in FIG. 2, a certain distance is provided between the shower 7 of the rinsing tank 102 and the air knife 3 of the drying tank 103 as shown in FIG. When the water-repellent film is exposed on the outermost surface of the glass substrate 1, the rinsing liquid, for example, pure water is partially repelled to generate polka dots 6. If air knife drying is performed in this state, there is a problem that a watermark 10 is formed after drying as shown in FIG.
【0006】図3に示す従来の他のエアナイフ乾燥方法
では、ガラス基板1が水平搬送から傾斜搬送に変わる際
にガラス基板1が持ち上がり搬送不良が生じる問題点が
あり、更にガラス基板1の最表面に露出している膜の揆
水性が強い場合、エアナイフ乾燥の直前に水玉を発生し
てしまい、図2の従来例と同様にウォータマークが生じ
る問題点があった。[0006] In the other conventional air knife drying method shown in FIG. 3, when the glass substrate 1 is changed from horizontal conveyance to inclined conveyance, the glass substrate 1 is lifted and a conveyance failure occurs. If the water repellency of the film exposed to the air is strong, polka dots are generated immediately before air knife drying, and there is a problem that a watermark is generated as in the conventional example of FIG.
【0007】[0007]
【課題を解決するための手段】本発明のエアナイフ乾燥
方法はエアナイフの直前にガラス基板とのクリアランス
ギャップを小さくしたスリット状リンス液シャワーを設
け、リンス液を搬送方向に吐出させ、エアナイフ乾燥の
直前までガラス基板を一様にリンス液で覆うようにした
ことを特徴とする。また、エアナイフの前後を隔離し、
ミストの再付着を防止してエアナイフ乾燥を行うことを
特徴とする。According to the air knife drying method of the present invention, a slit-shaped rinsing liquid shower having a reduced clearance gap with a glass substrate is provided immediately before the air knife, and the rinsing liquid is discharged in the transport direction, and the air knife drying is performed immediately before the air knife drying. Up to this point, the glass substrate is uniformly covered with a rinsing liquid. Also, isolate the front and back of the air knife,
Air knife drying is performed while preventing mist from re-adhering.
【0008】[0008]
【作用】本発明によれば、ガラス基板の最表面に強い揆
水性を示す膜がある場合においても、エアナイフの直前
で水玉が発生することを抑えることができ、ウォータマ
ークの発生も防止できる。更に従来の技術の他の例の問
題点である搬送不良の発生も防止できる。According to the present invention, even when there is a film showing strong water repellency on the outermost surface of the glass substrate, it is possible to suppress the occurrence of polka dots immediately before the air knife and to prevent the generation of a watermark. Further, it is possible to prevent the occurrence of a conveyance failure, which is a problem of another example of the prior art.
【0009】[0009]
【実施例】次に本発明について図面を参照にして説明す
る。図1(a),(b)は本発明の一実施例を示す側面
図と上面図である。図において、102はリンス槽、1
03は乾燥槽、104はアンローダ、2ははね返り隔離
板、4はスリット状リンス液シャワー、8はスリット状
リンス液シャワー4から吐出されたリンス液である。乾
燥槽の部分以外は図2の従来例と同じである。乾燥槽1
03にはスリット状リンス液シャワー4がエアナイフ3
の直前の位置に設けられている。乾燥槽103のスリッ
ト状リンス液シャワー4は、ガラス基板1とのクリアラ
ンスギャップを小さくし、ガラス基板1の搬送方向にリ
ンス液8が吐出されるように設置する。そしてエアナイ
フ3のエアがガラス基板1に吹きかかる部分まで、ガラ
ス基板1の表面をリンス液8で一様に覆う様にスリット
状リンス液シャワー4の流量を調整する。更にエアナイ
フ3には、リンス液8のはね返りミストがガラス基板1
に再付着することを防止するために、はね返り隔離板2
が設置されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. 1 (a) and 1 (b) are a side view and a top view showing one embodiment of the present invention. In the figure, 102 is a rinsing tank, 1
Numeral 03 denotes a drying tank, numeral 104 denotes an unloader, numeral 2 denotes a rebound separator, numeral 4 denotes a slit rinse liquid shower, and numeral 8 denotes a rinse liquid discharged from the slit rinse liquid shower 4. Except for the drying tank, the configuration is the same as the conventional example of FIG. Drying tank 1
03 is a slit-shaped rinse liquid shower 4 with an air knife 3
It is provided at a position immediately before. The slit-shaped rinsing liquid shower 4 of the drying tank 103 is set such that the clearance gap with the glass substrate 1 is reduced, and the rinsing liquid 8 is discharged in the transport direction of the glass substrate 1. Then, the flow rate of the slit-shaped rinsing liquid shower 4 is adjusted so that the surface of the glass substrate 1 is uniformly covered with the rinsing liquid 8 up to the portion where the air of the air knife 3 blows on the glass substrate 1. Further, the air knives 3 are sprayed with a mist of the rinsing liquid 8 so that the glass substrate 1
To prevent reattachment to the
Is installed.
【0010】これらによりガラス基板1の最表面の膜が
強い疏水性を示し、リンス槽102から搬出された時点
で水玉6が発生している場合においても、エアナイフ3
で高圧空気や高圧吹活性ガスを吹き付ける時点では、ガ
ラス基板1の最表面はリンス液8で覆れ、水玉6の発生
が無い状態でエアナイフ乾燥が行え、ウォータマークの
発生が防止できる。更にはね返り隔離板2によりリンス
液8のガラス基板1への再付着も防止できる。As a result, the film on the outermost surface of the glass substrate 1 shows strong hydrophobicity, and even when the polka dots 6 are generated when the film is unloaded from the rinsing tank 102, the air knife 3
When the high pressure air or the high pressure blowing active gas is blown, the outermost surface of the glass substrate 1 is covered with the rinsing liquid 8 and the air knife drying can be performed in a state where the polka dots 6 are not generated, so that the generation of the watermark can be prevented. Further, the rebound separator 2 can prevent the rinsing liquid 8 from re-adhering to the glass substrate 1.
【0011】[0011]
【発明の効果】以上説明したように本発明は、エアナイ
フ乾燥される時点では、リンス液でガラス基板の表面を
均一に覆い、水玉の発生を抑制し、ウォータマークの発
生を防止したので、製品の品質及び歩留りの向上がはか
れる。As described above, according to the present invention, when air knife drying is performed, the surface of the glass substrate is uniformly covered with the rinsing liquid to suppress the generation of polka dots and prevent the generation of watermarks. Quality and yield are improved.
【図1】(a),(b)は本発明の一実施例を示す側面
図と上面図である。1 (a) and 1 (b) are a side view and a top view showing one embodiment of the present invention.
【図2】従来の処理方法の例を示す図で、(a)は装置
全体の構成例,(b),(c)はリンス槽・乾燥槽の側
面図と上面図である。FIG. 2 is a view showing an example of a conventional processing method, in which (a) is a configuration example of the entire apparatus, and (b) and (c) are a side view and a top view of a rinsing tank / drying tank.
【図3】従来の処理方法の他の例を示す図である。FIG. 3 is a diagram showing another example of a conventional processing method.
100 ローダ 101 処理槽 102 リンス槽 103 乾燥槽 104 アンローダ 1 ガラス基板 2 はね返り隔離板 3 エアナイフ 4 スイット状リンス液シャワー 5 搬送ローラ 6 水玉 7 リンス液シャワー 8,9 リンス液 10 ウォータマーク REFERENCE SIGNS LIST 100 loader 101 processing tank 102 rinsing tank 103 drying tank 104 unloader 1 glass substrate 2 splash separator 3 air knife 4 switch-like rinsing liquid shower 5 transport roller 6 polka dot 7 rinsing liquid shower 8, 9 rinsing liquid 10 watermark
Claims (1)
グ、レジスト剥離等を行うリンス液を空気又は不活性ガ
ス等によりエアナイフ乾燥を行う方法において、エアナ
イフの直前の位置にスリット状リンス液シャワーを設
け、前記基板の進行方向にリンス液を吐出させて、エア
ナイフ乾燥の直前まで基板が一様にリンス液で覆われる
ようにしたことを特徴とするエアナイフ乾燥方法。In a method of drying a rinsing liquid for cleaning, wet etching, resist stripping and the like in a single wafer type with air or an inert gas, an air knife is used.
A slit-shaped rinsing liquid shower is installed just before
Rinsing liquid in the direction of travel of the substrate
Substrate is uniformly covered with rinsing liquid until just before knife drying
Air knife drying method being characterized in that as.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7040189A JP2699911B2 (en) | 1995-02-28 | 1995-02-28 | Air knife drying method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7040189A JP2699911B2 (en) | 1995-02-28 | 1995-02-28 | Air knife drying method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH08236498A JPH08236498A (en) | 1996-09-13 |
JP2699911B2 true JP2699911B2 (en) | 1998-01-19 |
Family
ID=12573838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7040189A Expired - Fee Related JP2699911B2 (en) | 1995-02-28 | 1995-02-28 | Air knife drying method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2699911B2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010035506A (en) * | 2001-02-22 | 2001-05-07 | 신원호 | Device for dry of LCD panel |
TWI283441B (en) * | 2001-03-14 | 2007-07-01 | Sumitomo Precision Prod Co | Substrate treating device |
JP2004095926A (en) * | 2002-09-02 | 2004-03-25 | Dainippon Screen Mfg Co Ltd | Substrate treatment equipment |
JP2006247541A (en) * | 2005-03-11 | 2006-09-21 | Toray Ind Inc | Liquid removing device |
DE102006034309A1 (en) * | 2006-07-21 | 2008-01-31 | Ic-Automation Gmbh | Device for cleaning a flat object |
JP6047359B2 (en) * | 2012-09-28 | 2016-12-21 | 株式会社Screenホールディングス | Substrate cleaning device |
CN107401914A (en) * | 2017-07-20 | 2017-11-28 | 郑州旭飞光电科技有限公司 | Air knife drying box |
CN108109946A (en) * | 2018-01-16 | 2018-06-01 | 昆山成功环保科技有限公司 | A kind of etching apparatus |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0744015Y2 (en) * | 1987-04-03 | 1995-10-09 | 大日本スクリーン製造株式会社 | Substrate drainer |
-
1995
- 1995-02-28 JP JP7040189A patent/JP2699911B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH08236498A (en) | 1996-09-13 |
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