JPH08181268A - Semiconductor device - Google Patents

Abstract

PURPOSE: To provide a semiconductor device which maintains a sufficient heat radiation capacity. CONSTITUTION: A die-pad 1 on which a semiconductor chip 6 is mounted is sealed in a resin package 5. Lead terminals 7 and radiation fins 3 which are linked with the die-pad 1 are drawn out from the package 5. The radiation fins 3 are linked downward with the die-pad 1 vertically and are connected to a heatsink which is provided on the surface or rear of a circuit board 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention aims at improving the heat dissipation of a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, there is a package in which a heat sink is embedded in the surface of a package in which a semiconductor chip is sealed.

[0003]

However, the above-mentioned conventional example has a drawback that the heat radiation capacity of the heat sink that can be embedded is limited due to the limitation of the size of the resin package.

The present invention has been made in view of the above points, and an object of the present invention is to provide a semiconductor device in which sufficient heat dissipation capacity can be easily secured.

[0005]

[Means for Solving the Problems] According to claim 1,
The die pad 1 on which the semiconductor chip 6 is mounted is sealed with a resin package 5, and the resin package 5 leads to the lead terminals 7
And a radiation fin 3 connected to the die pad 1 is led out.

Here, the heat radiation fins 3 may be formed by cutting and raising the lower surface side of the die pad 1.
It may be formed by being pendantly connected to the edge portion of.

Further, the radiation fin 3 may be connected to a heat sink 8 provided on the front surface or the back surface of the circuit board 2.

[0008]

[Operation] According to the invention of this application, the resin package 5
A heat sink 8 having a necessary capacity can be connected to the radiation fin 3 derived from the above. As a result, the heat of the semiconductor chip 6 accumulated in the die pad 1 can be efficiently radiated through the heat radiation fins 3.

In this case, if the heat sink 8 is provided on the circuit board 2, the heat dissipation capacity can be set without being restricted by the size of the resin package 5 or the like. In particular, the degree of freedom is high when the heat sink 8 is arranged on the surface of the circuit board 2 on which the circuit is not provided.

[0010]

EXAMPLES The present invention will be described below based on examples.

1 to 5 show a semiconductor device which is an embodiment of the present invention. In this semiconductor device, a die pad 1 on which a semiconductor chip 6 is mounted is sealed with a resin package 5, and from this resin package 5, lead terminals 7 and die pad 1 are formed.
The heat radiation fin 3 connected to is derived.

The radiation fins 3 are formed on the lower surface side of the die pad 1 as a plurality of cut and raised portions in two rows.

The lead terminals 7 are hung from both side surfaces of the resin package 5. This semiconductor device is used as follows.

FIG. 4 shows an example of this, in which the radiation fin 3 is soldered and connected to a heat sink 8 provided on the surface of the circuit board 2. Similarly, the lead terminal 7 is also soldered and connected to the circuit surface provided on the surface of the circuit board 2. Such a mounting structure is generally called surface mounting.

FIG. 5 shows another example of use in which the heat radiation fin 3 penetrates the circuit board 2 and is soldered to a heat sink 8 provided on the back surface thereof. The lead terminals 7 are inserted into the through holes of the circuit board 2 and then soldered to be connected to the circuit surface provided on the back surface of the circuit board 2. Such a mounting structure is generally called pin mounting.

6 to 10 show a semiconductor device which is a different embodiment of the present invention. In this semiconductor device, a die pad 1 on which a semiconductor chip 6 is mounted is sealed with a resin package 5, and a lead terminal 7 and a radiation fin 3 connected to the die pad 1 are led out from the resin package 5.

The radiation fins 3 are provided on the edge of the die pad 1,
It is in the form of a folded fold and hangs down.

The lead terminals 7 are hung from both side surfaces of the resin package 5. This semiconductor device is used as follows.

FIG. 9 shows one example of this use, in which this heat radiation fin 3 is connected to a heat sink 8 provided on the surface of the circuit board 2. Similarly, the lead terminal 7 is also soldered and connected to the circuit surface provided on the surface of the circuit board 2. Such a mounting structure is generally called surface mounting.

FIG. 10 shows another example of use in which the lower end portion of the heat radiation fin 3 penetrates the circuit board 2 and is soldered to the heat sink 8 provided on the back surface thereof. The lead terminals 7 are inserted into the through holes of the circuit board 2 and then soldered to be connected to the circuit surface provided on the back surface of the circuit board 2. This mounting structure is similar to what is generally called pin mounting.

[0021]

According to the invention of this application, the heat sink 8 having a necessary capacity can be connected to the radiation fin 3 led out from the resin package 5. As a result, the heat of the semiconductor chip 6 accumulated in the die pad 1 can be efficiently radiated through the heat radiation fins 3.

In this case, when the heat sink 8 is provided on the circuit board 2, the heat dissipation capacity can be set without being restricted by the size of the resin package 5 or the like. In particular, the degree of freedom is high when the heat sink 8 is arranged on the surface of the circuit board 2 on which the circuit is not provided.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a perspective view of the same.

FIG. 3 is a perspective view of a main part of the above.

FIG. 4 is a cross-sectional view showing a usage state of the same.

FIG. 5 is a cross-sectional view showing a usage state of the same.

FIG. 6 is a sectional view showing another embodiment of the present invention.

FIG. 7 is a perspective view of the above.

FIG. 8 is a perspective view of a main part of the above.

FIG. 9 is a cross-sectional view showing a usage state of the same.

FIG. 10 is a cross-sectional view showing a usage state of the above.

[Explanation of symbols]

 1 die pad 2 circuit board 3 radiating fins 5 resin package 6 semiconductor chip 7 lead terminal 8 heat sink

Claims (6)

[Claims] 1. A die pad 1 having a semiconductor chip 6 mounted thereon.
Is sealed with a resin package 5, and a radiation fin 3 connected to the lead terminal 7 and the die pad 1 is led out from the resin package 5. 2. The semiconductor device according to claim 1, wherein the radiation pad 3 is formed by cutting and raising the die pad 1 on the lower surface side. 3. The semiconductor device according to claim 1, wherein the radiation fins 3 are connected to the edge portions of the die pad 1 so as to hang down. 4. The semiconductor device according to claim 1, wherein the radiation fins 3 are hung and connected to the die pad 1, and the radiation fins 3 are connected to a heat sink 8 provided on the circuit board 2. 5. A semiconductor device, characterized in that a radiation fin (3) is hung and connected to a die pad (1) and the radiation fin (3) is connected to a heat sink (8) provided on the surface of a circuit board (2). 6. A semiconductor device, characterized in that a radiation fin 3 is hung and connected to a die pad 1, the radiation fin 3 penetrates the circuit board 2 and is connected to a heat sink 8 provided on the back surface thereof.