JP3079241U - Light emitting diode - Google Patents

Abstract

(57) [Summary] [Problem] To provide a light-emitting diode having improved luminous efficiency by increasing heat radiation efficiency. SOLUTION: The light emitting diode of the present invention has a support frame on which a chip is mounted is thickened to have a thickness of 0.6 mm or more, so that luminous efficiency and heat dissipation efficiency are enhanced, and a support frame heat dissipation block exposed at the bottom. Alternatively, heat dissipation efficiency is enhanced by the support frame heat dissipating block installed close to the bottom, and the leads are extended outward and further downward from both sides of the support frame so that the support frame and the support frame heat dissipating block are approached or printed. By contacting the substrate, the heat radiation area is increased, and the heat radiation efficiency is relatively increased.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a kind of light emitting diode, and more particularly, to a light emitting diode having a good heat radiation effect and a structure capable of increasing a light emitting efficiency.

[0002]

[Prior art]

 As shown in FIG. 1, a well-known upright type light emitting diode has a bowl-shaped portion formed on a support frame A2, accommodates the chip A1 in the bowl-shaped portion, and has two portions from the support frame A2. The lead is extended, and the end of the lead is welded to the solder point A3 on the printed circuit board. Such a well-known upright type light emitting diode has a relatively deep bowl-shaped portion, which can enhance luminous efficiency. However, since heat is radiated using one lead, the radiative efficiency is low, and theoretically, Luminous efficiency is proportional to luminous efficiency, and the lower the radiative effect, the lower the luminous efficiency. However, such an upright type light emitting diode could not improve the heat radiation effect by further improvement, and improvement was required.

In order to solve the above-mentioned problem of the light emitting diode, an improved light emitting diode as shown in FIG. 2 has been provided. That is, the leads are welded to the solder points B3 of the printed circuit board B4. In the light emitting diode having such a structure, the support frame B2 is relatively wide, the outer shape of the light emitting diode is reduced, and since the heat is radiated by two leads, the heat radiation ability is improved. However, since the support frame B2 is formed relatively thin, the bowl-shaped portion is relatively shallow, which is only about 0.4 mm as compared with the case where the above-mentioned upright type light emitting diode exceeds 0.4 mm. . There is also a relationship between the depth of the bowl-shaped part and the luminous efficiency, which limits the luminous efficiency and awaits improvement.

[0004]

[Problems to be solved by the invention]

 An object of the present invention is to provide a kind of light emitting diode, which increases the depth of the bowl-shaped portion to increase the heat radiation efficiency, double the light emitting efficiency of the light emitting diode, and realize industrial use. It shall have a valued structure.

[0005]

[Means for Solving the Problems]

 According to the first aspect of the present invention, a chip is mounted on a light emitting diode having a chip, a support frame for mounting the chip, and a lead, and a support frame heat-dissipating block provided on a bottom portion or a portion approaching the bottom of the support frame. The light emitting diode is characterized in that the thickness of the support frame is increased so that the depth of the bowl-shaped portion becomes 0.6 mm or more. According to a second aspect of the present invention, there is provided the light emitting diode according to the first aspect, wherein a heat radiating resin is provided at a bottom of the support frame and the heat radiating block of the support frame. According to a third aspect of the present invention, there is provided the light emitting diode according to the first aspect, wherein the support frame and the bottom of the support frame heat radiation block are joined to a printed circuit board. According to a fourth aspect of the present invention, there is provided the light emitting diode according to the second aspect, wherein a bottom portion of the heat radiation resin is bonded to a printed board.

[0006]

[Embodiment of the invention]

 In the light emitting diode of the present invention, the thickness of the support frame on which the chip is mounted is increased. When the thickness is 6 mm or more, the luminous efficiency and the heat radiation efficiency are enhanced, and the heat radiation efficiency is enhanced by the support frame heat radiation block exposed at the bottom or the support frame heat radiation block disposed close to the bottom, and By extending the leads outward and further downward from both sides of the support frame and bringing the support frame and the support frame heat-dissipating block closer or in contact with the printed circuit board, the heat-dissipation area increases and the heat-dissipation efficiency increases relatively. It is characterized by that.

[0007] In the above features, the thickness of the pressure-intensifying support frame increases the depth of the bowl-shaped portion and the heat-dissipating area, so that the luminous efficiency is increased, and the heat-dissipating block provided on the bottom portion increases the support frame bottom. And the bottom of the heat dissipation block contacts the printed circuit board and extends the heat dissipation area from the support frame to the entire printed circuit board, which achieves a much higher heat dissipation efficiency than that of the well-known suspended support frame structure. Therefore, the luminous efficiency can be greatly increased.

[0008]

【Example】

 FIG. 3 is a perspective view of a light emitting diode structure according to a preferred embodiment of the present invention, and FIG. 4 is a side perspective view of the preferred embodiment of the present invention. As shown in these figures, the light-emitting diode of the present embodiment has a bowl-shaped portion on which the chip C1 is mounted on the upper surface of the support frame C2, and the support frame C2 is larger than the well-known article shown in FIG. Since the thickness is increased, the bowl-shaped portion has a depth of 0.6 mm or more, so that the luminous efficiency can be greatly improved. Further, since the thickness of the support frame C2 is relatively thick and relatively wide, the leads are extended downward from both outer sides, so that the heat radiation area is relatively large and the heat radiation effect is increased. The support frame C2 is provided with a support frame heat radiation block 5 and a heat radiation resin C6 at the bottom of the support frame C2, and is welded to the printed circuit board C4 at a solder point C3 and contacts the printed circuit board C4 with a large area. Alternatively, the support frame C2 may employ a screwing method instead of the solder point C3 to increase heat radiation efficiency. The present invention can greatly increase the luminous efficiency in the results of theoretical and actual tests, and greatly enhance the function.

FIG. 5 is a perspective three-dimensional view of another preferred embodiment of the present invention, in which light emitting diodes of two or more colors of two chips are installed. The configuration of the present invention can also be used for light emitting diodes of two or more colors. For example, as shown in the figure, two bowl-shaped portions are cut and one chip is mounted on each of them, whereby a two-color light emitting diode is provided. Can be formed.

[0010]

[Effects of the Invention] Overall, the light-emitting diode of the present invention has a bowl-shaped portion having a depth of 0.6 mm or more, and has an increased heat dissipation volume and area to extend the heat dissipation area to the entire printed circuit board. This makes it possible to significantly increase the luminous efficiency due to the good heat dissipation efficiency, and it can be said that this is a device having an effect of improving functions. The above description relates to a preferred embodiment of the present invention, and does not limit the scope of the present invention. Any modification or alteration of details that can be made based on the present invention is not limited to the scope of the present invention. Shall belong to the box.

[Brief description of the drawings]

FIG. 1 is a side perspective view showing a configuration of a known upright type light emitting diode.

FIG. 2 is a side perspective view showing a configuration of a known upright type light emitting diode.

FIG. 3 is a perspective view showing the structure of the light emitting diode according to the present invention;

FIG. 4 is a side perspective view showing the configuration of the light emitting diode of the present invention.

FIG. 5 is a perspective view of another preferred embodiment of the present invention.

FIG. 6 is a perspective view of another preferred embodiment of the present invention.

[Explanation of symbols]

 A1, B1, C1 Chip A2, B2, C2 Support frame C21 Screw holes A3, B3, C3 Solder points A4, B4, C4 Printed circuit board C5 Support frame heat dissipation block C6 Heat dissipation resin

Claims (4)

[Utility model registration claims] 1. A light emitting diode comprising a chip, a support frame for mounting the chip, and a lead, and a support frame heat-dissipating block provided at a bottom portion of the support frame or at a portion close to the bottom portion. A light-emitting diode, characterized in that the support frame is thickened so that the depth of the support frame becomes 0.6 mm or more. 2. The light emitting diode according to claim 1, wherein a heat radiating resin is provided on the bottom of the support frame and the heat radiating block of the support frame. 3. The light emitting diode according to claim 1, wherein the support frame and the bottom of the support frame heat dissipation block are joined to a printed circuit board. 4. The light emitting diode according to claim 2, wherein a bottom portion of the heat dissipation resin is joined to a printed circuit board.