JPH0794617A - Semiconductor device - Google Patents

Abstract

PURPOSE:To enhance ESD protection without sacrifice of the characteristics of functional circuit. CONSTITUTION:An ESD protective circuit chip 2 is mounted through a bump 7b on a functional circuit chip 1 mounted on a package and then connected electrically with a functional circuit 1a. Consequently, the functional circuit chip 1 and the ESD protective circuit chip 2 can be formed under optimal conditions (especially in the diffusion conditions) and the characteristics of the functional circuit 1a can be improved while enhancing the ESD protection.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to an ESD (electrostatic disk) device.
rge) A semiconductor device having a protection circuit.

[0002]

2. Description of the Related Art A conventional semiconductor device is shown in FIG.
The functional circuit chip 1 in which the functional circuit 1a and the ESD protection circuit 2a are formed by the same diffusion is mounted on the package 5. The electrodes of the functional circuit chip 1 are connected to the wirings 4 formed on the package 5 via the bonding wires 3 and electrically connected to the external leads 6 connected to the wirings 4.

When the characteristics of the functional circuit 1a and the ESD protection circuit 2a are formed by the same diffusion, the characteristics of the two circuits have a contradictory relationship. Therefore, in order to make them compatible, the characteristics of the functional circuit 1a and the ESD protection circuit are compatible. The characteristics of 2a both cause the inconvenience of having to be designed at a position deviated from the optimum design. Also, if one of the circuits is out of specification due to dispersion in diffusion, the other circuit that satisfies the specification (the characteristics are close to the optimum value) is also in the same chip and must be discarded. There are drawbacks.

In order to improve such a defect, FIG.
As shown in FIG. 3, the skill circuit chip 1 and the ESD protection circuit chip 2 formed separately are mounted on the package 5, respectively, and electrically connected to the external lead 6 via the bonding wire 3 and the wiring 4 on the package. The structure is being considered. However, the functional circuit chips 1 and E
Mounting the SD protection circuit chip 2 on the package 5 has a drawback that the package becomes large. Further, since the signal can be taken out only from the periphery of the functional circuit 1a, E
The problem that the SD protection can be applied only to the circuit around the functional circuit 1a and the connection between the functional circuit 1a and the ESD protection circuit chip 2 via the bonding wire 3 increases the connection impedance and the response of the ESD protection. The drawback is that it becomes slower.

[0005]

This conventional semiconductor device has a problem in that it is not possible to design the circuit characteristics of both the functional circuit and the ESD protection circuit on the same chip so that both circuits cannot be optimized. , A functional circuit chip and an ESD that are separately formed to obtain optimum characteristics.
In the case where the protective circuit chip and the protective circuit chip are mounted on the package, the ESD protection can be performed only in the peripheral portion of the functional circuit chip, and the connection impedance between the functional circuit and the ESD protective circuit becomes large, resulting in a slow response of the ESD protection. There was a problem that it could not provide sufficient protection.

[0006]

A first semiconductor device of the present invention is a functional circuit chip mounted on a package, and a function mounted on the functional circuit chip via a bump and formed on the functional circuit chip. ESD electrically connected to the circuit
And a protection circuit chip.

A second semiconductor device of the present invention is a functional circuit chip mounted on a package, a groove or a recess formed on the upper surface of the functional circuit chip, and embedded in the groove or the recess and on the functional circuit chip. And an ESD protection circuit chip electrically connected to the functional circuit formed in the above.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a schematic sectional view showing a first embodiment of the present invention.

As shown in FIG. 1, the functional circuit chip 1 is mounted via the bumps 7a on the wiring 4 of the package having the wiring 4 and the external leads 6 connected to the wiring 4 on the upper surface. It is electrically connected to the formed functional circuit 1a. The ESD protection circuit chip 2 is mounted on the functional circuit chip 1 via the bumps 7b and electrically connected to the functional circuit 1a.

Here, since the ESD protection circuit chip 2 and the functional circuit chip 1 are formed separately, the optimum design can be used, and the ESD is provided via the bump 7b.
Since the protection circuit chip 2 and the functional circuit 1a are directly connected, the electrical impedance can be reduced to about 0.1 to 1.0Ω, and the response of ESD protection can be improved. Further, since the ESD protection circuit chip 2 can be directly connected to the functional circuit chip 1, there is an advantage that the ESD protection chip 2 can be connected to any place of the functional circuit 1a.

FIG. 2 is a schematic sectional view showing a second embodiment of the present invention.

As shown in FIG. 2, an ESD protection circuit chip 2 formed separately from the functional circuit chip 1 is embedded in a groove 8 or a recess formed on the upper surface of the functional circuit chip 1 and fixed with an adhesive or the like. The structure is similar to that of the first embodiment except that it is electrically connected to the functional circuit 1a formed on the functional circuit chip 1 by bonding wires, beam leads, etc. There is an advantage that the combination of the functional circuit formed under the conditions) and the ESD protection circuit can be connected with low impedance.

[0014]

As described above, according to the present invention, since the ESD protection circuit chip formed under the condition different from that of the functional circuit chip can be electrically connected to the functional circuit chip with low impedance, Without degrading the characteristics of
This has the effect of realizing a semiconductor device having a high ESD breakdown voltage.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing a first embodiment of the present invention.

FIG. 2 is a schematic sectional view showing a second embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view showing a first example of a conventional semiconductor device.

FIG. 4 is a schematic cross-sectional view showing a second example of a conventional semiconductor device.

[Explanation of symbols]

 1 Functional Circuit Chip 1a Functional Circuit 2 ESD Protection Circuit Chip 2a ESD Protection Circuit 3 Bonding Wire 4 Wiring 5 Package 6 External Lead 7, 7a, 7b Bump 8 Groove

Claims (2)

[Claims] 1. A functional circuit chip mounted on a package, and an ESD protection circuit chip mounted on the functional circuit chip via bumps and electrically connected to a functional circuit formed on the functional circuit chip. A semiconductor device characterized by the above. 2. A functional circuit chip mounted on a package, a groove or a recess formed on an upper surface of the functional circuit chip, a functional circuit embedded in the groove or the recess and formed on the functional circuit chip, and an electrical circuit. And an ESD protection circuit chip connected to the semiconductor device.