JPH078130Y2 - ＧａＡｓウェハの貼付装置 - Google Patents
ＧａＡｓウェハの貼付装置Info
- Publication number
- JPH078130Y2 JPH078130Y2 JP1987065493U JP6549387U JPH078130Y2 JP H078130 Y2 JPH078130 Y2 JP H078130Y2 JP 1987065493 U JP1987065493 U JP 1987065493U JP 6549387 U JP6549387 U JP 6549387U JP H078130 Y2 JPH078130 Y2 JP H078130Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wax
- gaas
- thickness
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910001218 Gallium arsenide Inorganic materials 0.000 title claims description 35
- 235000012431 wafers Nutrition 0.000 claims description 131
- 238000005498 polishing Methods 0.000 claims description 50
- 238000003825 pressing Methods 0.000 claims description 44
- 238000007599 discharging Methods 0.000 claims 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 29
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 230000001052 transient effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- -1 gallium arsenide (GaAs) compound Chemical class 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987065493U JPH078130Y2 (ja) | 1987-04-30 | 1987-04-30 | ＧａＡｓウェハの貼付装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987065493U JPH078130Y2 (ja) | 1987-04-30 | 1987-04-30 | ＧａＡｓウェハの貼付装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63172561U JPS63172561U (enrdf_load_stackoverflow) | 1988-11-09 |
| JPH078130Y2 true JPH078130Y2 (ja) | 1995-03-01 |
Family
ID=30902613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987065493U Expired - Lifetime JPH078130Y2 (ja) | 1987-04-30 | 1987-04-30 | ＧａＡｓウェハの貼付装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH078130Y2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2507478Y2 (ja) * | 1991-06-26 | 1996-08-14 | 株式会社エンヤシステム | ウエ―ハ反転貼付装置 |
| JP2006032815A (ja) * | 2004-07-21 | 2006-02-02 | Kazuo Tanabe | ウエーハと支持基板の貼り合せ方法及び装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6290944A (ja) * | 1985-10-17 | 1987-04-25 | Toshiba Ceramics Co Ltd | シリコンウエハ貼付装置 |
-
1987
- 1987-04-30 JP JP1987065493U patent/JPH078130Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63172561U (enrdf_load_stackoverflow) | 1988-11-09 |
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