JPS63172561U - - Google Patents
Info
- Publication number
- JPS63172561U JPS63172561U JP1987065493U JP6549387U JPS63172561U JP S63172561 U JPS63172561 U JP S63172561U JP 1987065493 U JP1987065493 U JP 1987065493U JP 6549387 U JP6549387 U JP 6549387U JP S63172561 U JPS63172561 U JP S63172561U
- Authority
- JP
- Japan
- Prior art keywords
- wafers
- semiconductor wafer
- wax
- wafer bonding
- polishing jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 claims 5
- 230000000754 repressing effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987065493U JPH078130Y2 (ja) | 1987-04-30 | 1987-04-30 | GaAsウェハの貼付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987065493U JPH078130Y2 (ja) | 1987-04-30 | 1987-04-30 | GaAsウェハの貼付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63172561U true JPS63172561U (enrdf_load_stackoverflow) | 1988-11-09 |
JPH078130Y2 JPH078130Y2 (ja) | 1995-03-01 |
Family
ID=30902613
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987065493U Expired - Lifetime JPH078130Y2 (ja) | 1987-04-30 | 1987-04-30 | GaAsウェハの貼付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH078130Y2 (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH054482U (ja) * | 1991-06-26 | 1993-01-22 | 株式会社エンヤシステム | ウエーハ反転貼付装置 |
JP2006032815A (ja) * | 2004-07-21 | 2006-02-02 | Kazuo Tanabe | ウエーハと支持基板の貼り合せ方法及び装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6290944A (ja) * | 1985-10-17 | 1987-04-25 | Toshiba Ceramics Co Ltd | シリコンウエハ貼付装置 |
-
1987
- 1987-04-30 JP JP1987065493U patent/JPH078130Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6290944A (ja) * | 1985-10-17 | 1987-04-25 | Toshiba Ceramics Co Ltd | シリコンウエハ貼付装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH054482U (ja) * | 1991-06-26 | 1993-01-22 | 株式会社エンヤシステム | ウエーハ反転貼付装置 |
JP2006032815A (ja) * | 2004-07-21 | 2006-02-02 | Kazuo Tanabe | ウエーハと支持基板の貼り合せ方法及び装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH078130Y2 (ja) | 1995-03-01 |