JPS63172561U - - Google Patents

Info

Publication number
JPS63172561U
JPS63172561U JP1987065493U JP6549387U JPS63172561U JP S63172561 U JPS63172561 U JP S63172561U JP 1987065493 U JP1987065493 U JP 1987065493U JP 6549387 U JP6549387 U JP 6549387U JP S63172561 U JPS63172561 U JP S63172561U
Authority
JP
Japan
Prior art keywords
wafers
semiconductor wafer
wax
wafer bonding
polishing jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987065493U
Other languages
English (en)
Japanese (ja)
Other versions
JPH078130Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987065493U priority Critical patent/JPH078130Y2/ja
Publication of JPS63172561U publication Critical patent/JPS63172561U/ja
Application granted granted Critical
Publication of JPH078130Y2 publication Critical patent/JPH078130Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP1987065493U 1987-04-30 1987-04-30 GaAsウェハの貼付装置 Expired - Lifetime JPH078130Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987065493U JPH078130Y2 (ja) 1987-04-30 1987-04-30 GaAsウェハの貼付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987065493U JPH078130Y2 (ja) 1987-04-30 1987-04-30 GaAsウェハの貼付装置

Publications (2)

Publication Number Publication Date
JPS63172561U true JPS63172561U (enrdf_load_stackoverflow) 1988-11-09
JPH078130Y2 JPH078130Y2 (ja) 1995-03-01

Family

ID=30902613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987065493U Expired - Lifetime JPH078130Y2 (ja) 1987-04-30 1987-04-30 GaAsウェハの貼付装置

Country Status (1)

Country Link
JP (1) JPH078130Y2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH054482U (ja) * 1991-06-26 1993-01-22 株式会社エンヤシステム ウエーハ反転貼付装置
JP2006032815A (ja) * 2004-07-21 2006-02-02 Kazuo Tanabe ウエーハと支持基板の貼り合せ方法及び装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6290944A (ja) * 1985-10-17 1987-04-25 Toshiba Ceramics Co Ltd シリコンウエハ貼付装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6290944A (ja) * 1985-10-17 1987-04-25 Toshiba Ceramics Co Ltd シリコンウエハ貼付装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH054482U (ja) * 1991-06-26 1993-01-22 株式会社エンヤシステム ウエーハ反転貼付装置
JP2006032815A (ja) * 2004-07-21 2006-02-02 Kazuo Tanabe ウエーハと支持基板の貼り合せ方法及び装置

Also Published As

Publication number Publication date
JPH078130Y2 (ja) 1995-03-01

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