JPH0756174Y2 - 樹脂モールド装置 - Google Patents

樹脂モールド装置

Info

Publication number
JPH0756174Y2
JPH0756174Y2 JP7760390U JP7760390U JPH0756174Y2 JP H0756174 Y2 JPH0756174 Y2 JP H0756174Y2 JP 7760390 U JP7760390 U JP 7760390U JP 7760390 U JP7760390 U JP 7760390U JP H0756174 Y2 JPH0756174 Y2 JP H0756174Y2
Authority
JP
Japan
Prior art keywords
lead frame
crushing block
resin
resin molding
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7760390U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0437313U (hu
Inventor
寛之 土屋
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP7760390U priority Critical patent/JPH0756174Y2/ja
Publication of JPH0437313U publication Critical patent/JPH0437313U/ja
Application granted granted Critical
Publication of JPH0756174Y2 publication Critical patent/JPH0756174Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP7760390U 1990-07-20 1990-07-20 樹脂モールド装置 Expired - Lifetime JPH0756174Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7760390U JPH0756174Y2 (ja) 1990-07-20 1990-07-20 樹脂モールド装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7760390U JPH0756174Y2 (ja) 1990-07-20 1990-07-20 樹脂モールド装置

Publications (2)

Publication Number Publication Date
JPH0437313U JPH0437313U (hu) 1992-03-30
JPH0756174Y2 true JPH0756174Y2 (ja) 1995-12-25

Family

ID=31620146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7760390U Expired - Lifetime JPH0756174Y2 (ja) 1990-07-20 1990-07-20 樹脂モールド装置

Country Status (1)

Country Link
JP (1) JPH0756174Y2 (hu)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6873008B2 (ja) * 2017-08-18 2021-05-19 ニチコン株式会社 ケースレスフィルムコンデンサの製造方法

Also Published As

Publication number Publication date
JPH0437313U (hu) 1992-03-30

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