JPH0751807Y2 - フレキシブル回路基板 - Google Patents
フレキシブル回路基板Info
- Publication number
- JPH0751807Y2 JPH0751807Y2 JP11520389U JP11520389U JPH0751807Y2 JP H0751807 Y2 JPH0751807 Y2 JP H0751807Y2 JP 11520389 U JP11520389 U JP 11520389U JP 11520389 U JP11520389 U JP 11520389U JP H0751807 Y2 JPH0751807 Y2 JP H0751807Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductive paste
- connection terminal
- circuit pattern
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011231 conductive filler Substances 0.000 claims description 15
- 238000004898 kneading Methods 0.000 claims description 10
- 229920000728 polyester Polymers 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 229920001225 polyester resin Polymers 0.000 claims description 5
- 239000004645 polyester resin Substances 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11520389U JPH0751807Y2 (ja) | 1989-09-29 | 1989-09-29 | フレキシブル回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11520389U JPH0751807Y2 (ja) | 1989-09-29 | 1989-09-29 | フレキシブル回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0353864U JPH0353864U (enrdf_load_stackoverflow) | 1991-05-24 |
| JPH0751807Y2 true JPH0751807Y2 (ja) | 1995-11-22 |
Family
ID=31663541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11520389U Expired - Lifetime JPH0751807Y2 (ja) | 1989-09-29 | 1989-09-29 | フレキシブル回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0751807Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006241844A (ja) * | 2005-03-03 | 2006-09-14 | Takiron Co Ltd | 階段用床材 |
-
1989
- 1989-09-29 JP JP11520389U patent/JPH0751807Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0353864U (enrdf_load_stackoverflow) | 1991-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3851223A (en) | Microcircuit board | |
| CN101951725A (zh) | 印刷电路板单元和电子装置 | |
| JPH0751807Y2 (ja) | フレキシブル回路基板 | |
| JPH0210571B2 (enrdf_load_stackoverflow) | ||
| JP2004303944A (ja) | モジュール基板及びその製造方法 | |
| JPH06152114A (ja) | 電気回路配線基板及びその製造方法並びに電気回路装置 | |
| JPH03116797A (ja) | 厚膜表面実装回路 | |
| JPH05259633A (ja) | 電子回路装置 | |
| JPH02260592A (ja) | 回路基板 | |
| JPS6153852B2 (enrdf_load_stackoverflow) | ||
| JP2842013B2 (ja) | 混成集積回路装置 | |
| JPH0231794Y2 (enrdf_load_stackoverflow) | ||
| JP2002280704A (ja) | 表面実装用電子部品の実装構造および実装方法 | |
| JPH069167U (ja) | 可撓性回路基板 | |
| JPH0610716Y2 (ja) | 回路基板 | |
| JP3005615U (ja) | コンデンサアレー | |
| KR100204613B1 (ko) | 인쇄회로기판의 제조방법 | |
| JPH03167890A (ja) | プリント配線板ユニットの形成方法 | |
| JPS60165790A (ja) | 電子回路基板の製造方法 | |
| JPH11150346A (ja) | 配線基板 | |
| JPS6258160B2 (enrdf_load_stackoverflow) | ||
| JPS5999787A (ja) | 厚膜配線基板 | |
| JPH118459A (ja) | 表面実装部品のプリント配線板への実装構造 | |
| JPH02260593A (ja) | 回路基板の製造法 | |
| JPH04303989A (ja) | 厚膜回路基板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |