JPH0749825Y2 - チップ部品の半田付構造 - Google Patents
チップ部品の半田付構造Info
- Publication number
- JPH0749825Y2 JPH0749825Y2 JP15082689U JP15082689U JPH0749825Y2 JP H0749825 Y2 JPH0749825 Y2 JP H0749825Y2 JP 15082689 U JP15082689 U JP 15082689U JP 15082689 U JP15082689 U JP 15082689U JP H0749825 Y2 JPH0749825 Y2 JP H0749825Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- solder
- wiring board
- printed wiring
- fillet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 title claims description 23
- 229910000679 solder Inorganic materials 0.000 claims description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- 238000007872 degassing Methods 0.000 claims description 3
- 230000004907 flux Effects 0.000 description 6
- 230000000873 masking effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15082689U JPH0749825Y2 (ja) | 1989-12-28 | 1989-12-28 | チップ部品の半田付構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15082689U JPH0749825Y2 (ja) | 1989-12-28 | 1989-12-28 | チップ部品の半田付構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0390473U JPH0390473U (enrdf_load_html_response) | 1991-09-13 |
| JPH0749825Y2 true JPH0749825Y2 (ja) | 1995-11-13 |
Family
ID=31697158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15082689U Expired - Lifetime JPH0749825Y2 (ja) | 1989-12-28 | 1989-12-28 | チップ部品の半田付構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0749825Y2 (enrdf_load_html_response) |
-
1989
- 1989-12-28 JP JP15082689U patent/JPH0749825Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0390473U (enrdf_load_html_response) | 1991-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2541063Y2 (ja) | プリント基板のパターン構造 | |
| JPH0749825Y2 (ja) | チップ部品の半田付構造 | |
| JPH0786729A (ja) | プリント配線板におけるジャンパーランドの接続構造及びジャンパーランドの接続方法 | |
| JPH10335795A (ja) | プリント基板 | |
| JPH0749826Y2 (ja) | チップ部品の半田付構造 | |
| JPH08181424A (ja) | プリント基板及びその半田付け方法 | |
| JPH0427183Y2 (enrdf_load_html_response) | ||
| JP2725646B2 (ja) | 半導体部品およびその実装方法 | |
| JPH06164120A (ja) | プリント配線基板 | |
| JP2554693Y2 (ja) | プリント基板 | |
| JPS5853890A (ja) | 電子部品のはんだ付け方法 | |
| JPS635260Y2 (enrdf_load_html_response) | ||
| JPH03159291A (ja) | プリント配線基板 | |
| JPH03132092A (ja) | 印刷配線基板 | |
| JP2545679Y2 (ja) | プリント基板のタブ端子用ランド形状 | |
| JPH0414892A (ja) | プリント配線基板のハンダレジスト開口部の構造 | |
| JP2543858Y2 (ja) | プリント基板 | |
| JPH04243187A (ja) | プリント基板 | |
| JPH0349418Y2 (enrdf_load_html_response) | ||
| JPS5844605Y2 (ja) | プリント基板における半田ブリツジ防止構造 | |
| JPH09135070A (ja) | プリント基板 | |
| JPH01218092A (ja) | 印刷配線基板の製造方法 | |
| JP2000357860A (ja) | 面実装部品のプリント配線基板への取付方法及びプリント配線基板 | |
| JPH0258294A (ja) | 印刷配線板への表面実装部品取付法 | |
| JPH07326851A (ja) | プリント回路 |