JPH0741165Y2 - 樹脂封止型半導体装置用リードフレーム - Google Patents

樹脂封止型半導体装置用リードフレーム

Info

Publication number
JPH0741165Y2
JPH0741165Y2 JP1987113828U JP11382887U JPH0741165Y2 JP H0741165 Y2 JPH0741165 Y2 JP H0741165Y2 JP 1987113828 U JP1987113828 U JP 1987113828U JP 11382887 U JP11382887 U JP 11382887U JP H0741165 Y2 JPH0741165 Y2 JP H0741165Y2
Authority
JP
Japan
Prior art keywords
lead
support plate
guide
resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987113828U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6420743U (enExample
Inventor
定雄 吉田
薫 芦塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP1987113828U priority Critical patent/JPH0741165Y2/ja
Publication of JPS6420743U publication Critical patent/JPS6420743U/ja
Application granted granted Critical
Publication of JPH0741165Y2 publication Critical patent/JPH0741165Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1987113828U 1987-07-27 1987-07-27 樹脂封止型半導体装置用リードフレーム Expired - Lifetime JPH0741165Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987113828U JPH0741165Y2 (ja) 1987-07-27 1987-07-27 樹脂封止型半導体装置用リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987113828U JPH0741165Y2 (ja) 1987-07-27 1987-07-27 樹脂封止型半導体装置用リードフレーム

Publications (2)

Publication Number Publication Date
JPS6420743U JPS6420743U (enExample) 1989-02-01
JPH0741165Y2 true JPH0741165Y2 (ja) 1995-09-20

Family

ID=31354016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987113828U Expired - Lifetime JPH0741165Y2 (ja) 1987-07-27 1987-07-27 樹脂封止型半導体装置用リードフレーム

Country Status (1)

Country Link
JP (1) JPH0741165Y2 (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155757A (en) * 1981-03-23 1982-09-25 Hitachi Ltd Semiconductor device
JPS6156420A (ja) * 1984-07-31 1986-03-22 Sanken Electric Co Ltd 樹脂封止形半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6420743U (enExample) 1989-02-01

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