JPH0739238Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0739238Y2 JPH0739238Y2 JP1987166036U JP16603687U JPH0739238Y2 JP H0739238 Y2 JPH0739238 Y2 JP H0739238Y2 JP 1987166036 U JP1987166036 U JP 1987166036U JP 16603687 U JP16603687 U JP 16603687U JP H0739238 Y2 JPH0739238 Y2 JP H0739238Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- semiconductor chip
- hole
- metal
- metal layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 31
- 239000002184 metal Substances 0.000 claims description 65
- 229910052751 metal Inorganic materials 0.000 claims description 65
- 239000000463 material Substances 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000000945 filler Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000010949 copper Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 10
- 230000035939 shock Effects 0.000 description 10
- 229910052742 iron Inorganic materials 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166036U JPH0739238Y2 (ja) | 1987-10-28 | 1987-10-28 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166036U JPH0739238Y2 (ja) | 1987-10-28 | 1987-10-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0170353U JPH0170353U (enrdf_load_html_response) | 1989-05-10 |
| JPH0739238Y2 true JPH0739238Y2 (ja) | 1995-09-06 |
Family
ID=31453062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987166036U Expired - Lifetime JPH0739238Y2 (ja) | 1987-10-28 | 1987-10-28 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739238Y2 (enrdf_load_html_response) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6027151A (ja) * | 1983-07-25 | 1985-02-12 | Sumitomo Electric Ind Ltd | 半導体素子搭載用複合金属条 |
| JPS60165744A (ja) * | 1984-02-09 | 1985-08-28 | Toshiba Corp | 半導体整流素子 |
-
1987
- 1987-10-28 JP JP1987166036U patent/JPH0739238Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0170353U (enrdf_load_html_response) | 1989-05-10 |
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