JPH0737313Y2 - スパッタリング装置 - Google Patents
スパッタリング装置Info
- Publication number
- JPH0737313Y2 JPH0737313Y2 JP1987100624U JP10062487U JPH0737313Y2 JP H0737313 Y2 JPH0737313 Y2 JP H0737313Y2 JP 1987100624 U JP1987100624 U JP 1987100624U JP 10062487 U JP10062487 U JP 10062487U JP H0737313 Y2 JPH0737313 Y2 JP H0737313Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- substrate
- etching
- stopper
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004544 sputter deposition Methods 0.000 title claims description 25
- 239000000758 substrate Substances 0.000 claims description 84
- 239000004065 semiconductor Substances 0.000 claims description 49
- 238000005530 etching Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 10
- 238000000992 sputter etching Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005478 sputtering type Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987100624U JPH0737313Y2 (ja) | 1987-06-30 | 1987-06-30 | スパッタリング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987100624U JPH0737313Y2 (ja) | 1987-06-30 | 1987-06-30 | スパッタリング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS646037U JPS646037U (cs) | 1989-01-13 |
| JPH0737313Y2 true JPH0737313Y2 (ja) | 1995-08-23 |
Family
ID=31328867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987100624U Expired - Lifetime JPH0737313Y2 (ja) | 1987-06-30 | 1987-06-30 | スパッタリング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0737313Y2 (cs) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5681533U (cs) * | 1979-11-27 | 1981-07-01 | ||
| JPS60249329A (ja) * | 1984-05-25 | 1985-12-10 | Anelva Corp | スパッタエッチング装置 |
-
1987
- 1987-06-30 JP JP1987100624U patent/JPH0737313Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS646037U (cs) | 1989-01-13 |
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