JPH0735403Y2 - リードフレーム - Google Patents

リードフレーム

Info

Publication number
JPH0735403Y2
JPH0735403Y2 JP1987137391U JP13739187U JPH0735403Y2 JP H0735403 Y2 JPH0735403 Y2 JP H0735403Y2 JP 1987137391 U JP1987137391 U JP 1987137391U JP 13739187 U JP13739187 U JP 13739187U JP H0735403 Y2 JPH0735403 Y2 JP H0735403Y2
Authority
JP
Japan
Prior art keywords
lead frame
die pad
chip
pad portion
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987137391U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6441146U (pt
Inventor
和夫 池永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1987137391U priority Critical patent/JPH0735403Y2/ja
Publication of JPS6441146U publication Critical patent/JPS6441146U/ja
Application granted granted Critical
Publication of JPH0735403Y2 publication Critical patent/JPH0735403Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1987137391U 1987-09-08 1987-09-08 リードフレーム Expired - Lifetime JPH0735403Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987137391U JPH0735403Y2 (ja) 1987-09-08 1987-09-08 リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987137391U JPH0735403Y2 (ja) 1987-09-08 1987-09-08 リードフレーム

Publications (2)

Publication Number Publication Date
JPS6441146U JPS6441146U (pt) 1989-03-13
JPH0735403Y2 true JPH0735403Y2 (ja) 1995-08-09

Family

ID=31398773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987137391U Expired - Lifetime JPH0735403Y2 (ja) 1987-09-08 1987-09-08 リードフレーム

Country Status (1)

Country Link
JP (1) JPH0735403Y2 (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5703008B2 (ja) * 2010-12-16 2015-04-15 新電元工業株式会社 フレーム組立体、半導体装置及びその製造方法
JP2020094933A (ja) * 2018-12-13 2020-06-18 日立オートモティブシステムズ株式会社 熱式流量計

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5662345A (en) * 1979-10-26 1981-05-28 Hitachi Ltd Load frame and semiconductor device
JPS6284541A (ja) * 1985-10-08 1987-04-18 Sumitomo Electric Ind Ltd 半導体装置用リ−ドフレ−ム
JPS62136059A (ja) * 1985-12-09 1987-06-19 Mitsubishi Electric Corp 樹脂封止半導体装置用リ−ドフレ−ム

Also Published As

Publication number Publication date
JPS6441146U (pt) 1989-03-13

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