JPH0731563Y2 - 混成集積回路のケース材 - Google Patents
混成集積回路のケース材Info
- Publication number
- JPH0731563Y2 JPH0731563Y2 JP1990056824U JP5682490U JPH0731563Y2 JP H0731563 Y2 JPH0731563 Y2 JP H0731563Y2 JP 1990056824 U JP1990056824 U JP 1990056824U JP 5682490 U JP5682490 U JP 5682490U JP H0731563 Y2 JPH0731563 Y2 JP H0731563Y2
- Authority
- JP
- Japan
- Prior art keywords
- hybrid integrated
- integrated circuit
- circuit board
- substrate
- case material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title claims description 40
- 238000010396 two-hybrid screening Methods 0.000 claims description 4
- 238000010397 one-hybrid screening Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 59
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990056824U JPH0731563Y2 (ja) | 1990-05-29 | 1990-05-29 | 混成集積回路のケース材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990056824U JPH0731563Y2 (ja) | 1990-05-29 | 1990-05-29 | 混成集積回路のケース材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0415268U JPH0415268U (enrdf_load_stackoverflow) | 1992-02-06 |
| JPH0731563Y2 true JPH0731563Y2 (ja) | 1995-07-19 |
Family
ID=31580997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990056824U Expired - Lifetime JPH0731563Y2 (ja) | 1990-05-29 | 1990-05-29 | 混成集積回路のケース材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0731563Y2 (enrdf_load_stackoverflow) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63273340A (ja) * | 1987-04-30 | 1988-11-10 | Nec Corp | 混成集積回路装置 |
| JPH01121976U (enrdf_load_stackoverflow) * | 1988-02-13 | 1989-08-18 |
-
1990
- 1990-05-29 JP JP1990056824U patent/JPH0731563Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0415268U (enrdf_load_stackoverflow) | 1992-02-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |