JPH07302822A - 半導体装置のための超音波溶接されたプラスチック支持リング - Google Patents

半導体装置のための超音波溶接されたプラスチック支持リング

Info

Publication number
JPH07302822A
JPH07302822A JP7047235A JP4723595A JPH07302822A JP H07302822 A JPH07302822 A JP H07302822A JP 7047235 A JP7047235 A JP 7047235A JP 4723595 A JP4723595 A JP 4723595A JP H07302822 A JPH07302822 A JP H07302822A
Authority
JP
Japan
Prior art keywords
support ring
lead frame
semiconductor device
manufacturing
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7047235A
Other languages
English (en)
Japanese (ja)
Inventor
Robert N Mclellan
エヌ．マクレラン ロバート
Anthony M Chiu
エム．チウ アンソニー
Paul J Hundt
ジェイ．フント ポール
William K Dennis
ケイ．デニス ウィリアム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPH07302822A publication Critical patent/JPH07302822A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/07232—
    • H10P72/74—
    • H10P72/0446—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP7047235A 1994-03-07 1995-03-07 半導体装置のための超音波溶接されたプラスチック支持リング Pending JPH07302822A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/206,814 US5661900A (en) 1994-03-07 1994-03-07 Method of fabricating an ultrasonically welded plastic support ring
US206814 1994-03-07

Publications (1)

Publication Number Publication Date
JPH07302822A true JPH07302822A (ja) 1995-11-14

Family

ID=22768088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7047235A Pending JPH07302822A (ja) 1994-03-07 1995-03-07 半導体装置のための超音波溶接されたプラスチック支持リング

Country Status (5)

Country Link
US (1) US5661900A (cg-RX-API-DMAC10.html)
EP (1) EP0671763A3 (cg-RX-API-DMAC10.html)
JP (1) JPH07302822A (cg-RX-API-DMAC10.html)
KR (1) KR950034640A (cg-RX-API-DMAC10.html)
TW (1) TW269739B (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6071759A (en) * 1996-07-15 2000-06-06 Matsushita Electronics Corporation Method for manufacturing semiconductor apparatus
DE19632094A1 (de) * 1996-08-08 1998-02-12 Siemens Ag Waferrahmen
JPH10303352A (ja) * 1997-04-22 1998-11-13 Toshiba Corp 半導体装置および半導体装置の製造方法
US20020011909A1 (en) * 2000-07-31 2002-01-31 Delta Electronics, Inc. Method for packing electronic device by interconnecting frame body and frame leads with insulating block and its packing structure
US9827729B2 (en) 2012-05-25 2017-11-28 Phoenix Packaging Operations, LLC Food container top with integrally formed utensil

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
US3436810A (en) * 1967-07-17 1969-04-08 Jade Corp Method of packaging integrated circuits
US3711625A (en) * 1971-03-31 1973-01-16 Microsystems Int Ltd Plastic support means for lead frame ends
FR2476960A1 (fr) * 1980-02-26 1981-08-28 Thomson Csf Procede d'encapsulation hermetique de composants electroniques a tres haute frequence, comportant la pose de traversees metalliques, dispositif realise par un tel procede
JPS59149042A (ja) * 1983-02-15 1984-08-25 Hitachi Cable Ltd 半導体用リ−ドフレ−ム
US4837184A (en) * 1988-01-04 1989-06-06 Motorola Inc. Process of making an electronic device package with peripheral carrier structure of low-cost plastic
JPH03136267A (ja) * 1989-10-20 1991-06-11 Texas Instr Japan Ltd 半導体装置及びその製造方法
JPH046859A (ja) * 1990-04-24 1992-01-10 Sony Corp 樹脂封止型半導体装置
GB9018764D0 (en) * 1990-08-28 1990-10-10 Lsi Logic Europ Packaging of electronic devices
JP2516709B2 (ja) * 1990-11-27 1996-07-24 住友金属鉱山株式会社 複合リ―ドフレ―ム
US5132773A (en) * 1991-02-06 1992-07-21 Olin Corporation Carrier ring having first and second ring means with bonded surfaces
US5177591A (en) * 1991-08-20 1993-01-05 Emanuel Norbert T Multi-layered fluid soluble alignment bars
US5352633A (en) * 1992-06-02 1994-10-04 Texas Instruments Incorporated Semiconductor lead frame lead stabilization

Also Published As

Publication number Publication date
KR950034640A (ko) 1995-12-28
EP0671763A2 (en) 1995-09-13
EP0671763A3 (en) 1997-04-09
TW269739B (cg-RX-API-DMAC10.html) 1996-02-01
US5661900A (en) 1997-09-02

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