JPH0727628Y2 - ウエハ保持治具 - Google Patents

ウエハ保持治具

Info

Publication number
JPH0727628Y2
JPH0727628Y2 JP1989133865U JP13386589U JPH0727628Y2 JP H0727628 Y2 JPH0727628 Y2 JP H0727628Y2 JP 1989133865 U JP1989133865 U JP 1989133865U JP 13386589 U JP13386589 U JP 13386589U JP H0727628 Y2 JPH0727628 Y2 JP H0727628Y2
Authority
JP
Japan
Prior art keywords
wafer
diameter
dedicated
recess
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989133865U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0373452U (cg-RX-API-DMAC7.html
Inventor
敏行 堀内
公吉 出口
茂久 大木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP1989133865U priority Critical patent/JPH0727628Y2/ja
Publication of JPH0373452U publication Critical patent/JPH0373452U/ja
Application granted granted Critical
Publication of JPH0727628Y2 publication Critical patent/JPH0727628Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
JP1989133865U 1989-11-20 1989-11-20 ウエハ保持治具 Expired - Lifetime JPH0727628Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989133865U JPH0727628Y2 (ja) 1989-11-20 1989-11-20 ウエハ保持治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989133865U JPH0727628Y2 (ja) 1989-11-20 1989-11-20 ウエハ保持治具

Publications (2)

Publication Number Publication Date
JPH0373452U JPH0373452U (cg-RX-API-DMAC7.html) 1991-07-24
JPH0727628Y2 true JPH0727628Y2 (ja) 1995-06-21

Family

ID=31681251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989133865U Expired - Lifetime JPH0727628Y2 (ja) 1989-11-20 1989-11-20 ウエハ保持治具

Country Status (1)

Country Link
JP (1) JPH0727628Y2 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100405569C (zh) * 2004-09-27 2008-07-23 三菱电机株式会社 半导体制造装置
JP5621142B2 (ja) * 2013-04-02 2014-11-05 独立行政法人産業技術総合研究所 半導体プロセス用キャリア
JP5959069B2 (ja) * 2014-07-14 2016-08-02 国立研究開発法人産業技術総合研究所 半導体プロセス用キャリア
JP6580544B2 (ja) * 2016-10-20 2019-09-25 エーエスエムエル ネザーランズ ビー．ブイ． 基板支持ユニット上に基板を位置合わせする方法および装置
US10133186B2 (en) 2016-10-20 2018-11-20 Mapper Lithography Ip B.V. Method and apparatus for aligning substrates on a substrate support unit
JP7539843B2 (ja) * 2021-01-19 2024-08-26 株式会社アドバンテスト プローブカード及び電子部品試験装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02108331U (cg-RX-API-DMAC7.html) * 1989-02-15 1990-08-29

Also Published As

Publication number Publication date
JPH0373452U (cg-RX-API-DMAC7.html) 1991-07-24

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