JPH0720920Y2 - Ｉｃパツケ−ジ - Google Patents
Ｉｃパツケ−ジInfo
- Publication number
- JPH0720920Y2 JPH0720920Y2 JP1987077362U JP7736287U JPH0720920Y2 JP H0720920 Y2 JPH0720920 Y2 JP H0720920Y2 JP 1987077362 U JP1987077362 U JP 1987077362U JP 7736287 U JP7736287 U JP 7736287U JP H0720920 Y2 JPH0720920 Y2 JP H0720920Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- chip
- power supply
- package body
- inductance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007769 metal material Substances 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 7
- 239000003989 dielectric material Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 description 16
- 238000002955 isolation Methods 0.000 description 13
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987077362U JPH0720920Y2 (ja) | 1987-05-25 | 1987-05-25 | Ｉｃパツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987077362U JPH0720920Y2 (ja) | 1987-05-25 | 1987-05-25 | Ｉｃパツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63187341U JPS63187341U (enrdf_load_stackoverflow) | 1988-11-30 |
| JPH0720920Y2 true JPH0720920Y2 (ja) | 1995-05-15 |
Family
ID=30925295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987077362U Expired - Lifetime JPH0720920Y2 (ja) | 1987-05-25 | 1987-05-25 | Ｉｃパツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0720920Y2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4575261B2 (ja) * | 2005-09-14 | 2010-11-04 | 株式会社東芝 | 高周波用パッケージ |
| JP6462535B2 (ja) * | 2015-08-28 | 2019-01-30 | 株式会社東芝 | 高周波半導体装置 |
| US11037883B2 (en) * | 2018-11-16 | 2021-06-15 | Analog Devices International Unlimited Company | Regulator circuit package techniques |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61134060A (ja) * | 1984-12-04 | 1986-06-21 | Nec Corp | コンデンサ内蔵型半導体装置及びその製造方法 |
-
1987
- 1987-05-25 JP JP1987077362U patent/JPH0720920Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63187341U (enrdf_load_stackoverflow) | 1988-11-30 |
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