JPH0719165Y2 - マルチチップ構造 - Google Patents

マルチチップ構造

Info

Publication number
JPH0719165Y2
JPH0719165Y2 JP1988164104U JP16410488U JPH0719165Y2 JP H0719165 Y2 JPH0719165 Y2 JP H0719165Y2 JP 1988164104 U JP1988164104 U JP 1988164104U JP 16410488 U JP16410488 U JP 16410488U JP H0719165 Y2 JPH0719165 Y2 JP H0719165Y2
Authority
JP
Japan
Prior art keywords
chip
bumps
bump
chips
printed board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988164104U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0284347U (en:Method
Inventor
義一 大江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1988164104U priority Critical patent/JPH0719165Y2/ja
Publication of JPH0284347U publication Critical patent/JPH0284347U/ja
Application granted granted Critical
Publication of JPH0719165Y2 publication Critical patent/JPH0719165Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W90/754—

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1988164104U 1988-12-19 1988-12-19 マルチチップ構造 Expired - Lifetime JPH0719165Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988164104U JPH0719165Y2 (ja) 1988-12-19 1988-12-19 マルチチップ構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988164104U JPH0719165Y2 (ja) 1988-12-19 1988-12-19 マルチチップ構造

Publications (2)

Publication Number Publication Date
JPH0284347U JPH0284347U (en:Method) 1990-06-29
JPH0719165Y2 true JPH0719165Y2 (ja) 1995-05-01

Family

ID=31449420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988164104U Expired - Lifetime JPH0719165Y2 (ja) 1988-12-19 1988-12-19 マルチチップ構造

Country Status (1)

Country Link
JP (1) JPH0719165Y2 (en:Method)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302212A (ja) 2008-06-11 2009-12-24 Fujitsu Microelectronics Ltd 半導体装置及びその製造方法
JP5678978B2 (ja) * 2013-03-11 2015-03-04 富士通セミコンダクター株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0284347U (en:Method) 1990-06-29

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