JPH0718756Y2 - 基板保持装置 - Google Patents
基板保持装置Info
- Publication number
- JPH0718756Y2 JPH0718756Y2 JP14010089U JP14010089U JPH0718756Y2 JP H0718756 Y2 JPH0718756 Y2 JP H0718756Y2 JP 14010089 U JP14010089 U JP 14010089U JP 14010089 U JP14010089 U JP 14010089U JP H0718756 Y2 JPH0718756 Y2 JP H0718756Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- clamper
- shafts
- substrate table
- shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 107
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 208000024891 symptom Diseases 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14010089U JPH0718756Y2 (ja) | 1989-12-01 | 1989-12-01 | 基板保持装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14010089U JPH0718756Y2 (ja) | 1989-12-01 | 1989-12-01 | 基板保持装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0378058U JPH0378058U (enrdf_load_stackoverflow) | 1991-08-07 |
| JPH0718756Y2 true JPH0718756Y2 (ja) | 1995-05-01 |
Family
ID=31687098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14010089U Expired - Lifetime JPH0718756Y2 (ja) | 1989-12-01 | 1989-12-01 | 基板保持装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0718756Y2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003123682A (ja) * | 2001-10-18 | 2003-04-25 | Hitachi High-Technologies Corp | 荷電粒子線装置 |
| JP2013093279A (ja) * | 2011-10-27 | 2013-05-16 | Hitachi High-Technologies Corp | 有機ｅｌデバイス製造装置 |
| JP7255078B2 (ja) * | 2018-03-20 | 2023-04-11 | 日新電機株式会社 | クランプ機構及び当該クランプ機構を備える基板保持装置 |
| CN112410745A (zh) * | 2020-10-26 | 2021-02-26 | Tcl华星光电技术有限公司 | 夹持装置及夹持装置的控制方法 |
-
1989
- 1989-12-01 JP JP14010089U patent/JPH0718756Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0378058U (enrdf_load_stackoverflow) | 1991-08-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |