JPH0718566Y2 - テーピング装置 - Google Patents
テーピング装置Info
- Publication number
- JPH0718566Y2 JPH0718566Y2 JP1989016659U JP1665989U JPH0718566Y2 JP H0718566 Y2 JPH0718566 Y2 JP H0718566Y2 JP 1989016659 U JP1989016659 U JP 1989016659U JP 1665989 U JP1665989 U JP 1665989U JP H0718566 Y2 JPH0718566 Y2 JP H0718566Y2
- Authority
- JP
- Japan
- Prior art keywords
- sop
- adhesive tape
- adhesive
- pressure
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002390 adhesive tape Substances 0.000 claims description 33
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 4
- 230000001678 irradiating effect Effects 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 239000006258 conductive agent Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Packages (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989016659U JPH0718566Y2 (ja) | 1989-02-15 | 1989-02-15 | テーピング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989016659U JPH0718566Y2 (ja) | 1989-02-15 | 1989-02-15 | テーピング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02108805U JPH02108805U (enrdf_load_stackoverflow) | 1990-08-29 |
| JPH0718566Y2 true JPH0718566Y2 (ja) | 1995-05-01 |
Family
ID=31229780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989016659U Expired - Lifetime JPH0718566Y2 (ja) | 1989-02-15 | 1989-02-15 | テーピング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0718566Y2 (enrdf_load_stackoverflow) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63155642A (ja) * | 1986-12-18 | 1988-06-28 | Nitto Electric Ind Co Ltd | 半導体ウエハの自動貼付け装置 |
| JPS63258717A (ja) * | 1987-04-10 | 1988-10-26 | ホ−プ精機株式会社 | ヒユ−ズクリツプのテ−ピング装置 |
-
1989
- 1989-02-15 JP JP1989016659U patent/JPH0718566Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02108805U (enrdf_load_stackoverflow) | 1990-08-29 |
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