JPH02108805U - - Google Patents
Info
- Publication number
- JPH02108805U JPH02108805U JP1665989U JP1665989U JPH02108805U JP H02108805 U JPH02108805 U JP H02108805U JP 1665989 U JP1665989 U JP 1665989U JP 1665989 U JP1665989 U JP 1665989U JP H02108805 U JPH02108805 U JP H02108805U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- taping device
- adhesive
- treating
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002390 adhesive tape Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Packages (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989016659U JPH0718566Y2 (ja) | 1989-02-15 | 1989-02-15 | テーピング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989016659U JPH0718566Y2 (ja) | 1989-02-15 | 1989-02-15 | テーピング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02108805U true JPH02108805U (enrdf_load_stackoverflow) | 1990-08-29 |
| JPH0718566Y2 JPH0718566Y2 (ja) | 1995-05-01 |
Family
ID=31229780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989016659U Expired - Lifetime JPH0718566Y2 (ja) | 1989-02-15 | 1989-02-15 | テーピング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0718566Y2 (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63155642A (ja) * | 1986-12-18 | 1988-06-28 | Nitto Electric Ind Co Ltd | 半導体ウエハの自動貼付け装置 |
| JPS63258717A (ja) * | 1987-04-10 | 1988-10-26 | ホ−プ精機株式会社 | ヒユ−ズクリツプのテ−ピング装置 |
-
1989
- 1989-02-15 JP JP1989016659U patent/JPH0718566Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63155642A (ja) * | 1986-12-18 | 1988-06-28 | Nitto Electric Ind Co Ltd | 半導体ウエハの自動貼付け装置 |
| JPS63258717A (ja) * | 1987-04-10 | 1988-10-26 | ホ−プ精機株式会社 | ヒユ−ズクリツプのテ−ピング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0718566Y2 (ja) | 1995-05-01 |