JPH071800Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH071800Y2
JPH071800Y2 JP16649388U JP16649388U JPH071800Y2 JP H071800 Y2 JPH071800 Y2 JP H071800Y2 JP 16649388 U JP16649388 U JP 16649388U JP 16649388 U JP16649388 U JP 16649388U JP H071800 Y2 JPH071800 Y2 JP H071800Y2
Authority
JP
Japan
Prior art keywords
resin
package
lead
semiconductor device
tie bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP16649388U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0286142U (en, 2012
Inventor
文雄 乙山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP16649388U priority Critical patent/JPH071800Y2/ja
Publication of JPH0286142U publication Critical patent/JPH0286142U/ja
Application granted granted Critical
Publication of JPH071800Y2 publication Critical patent/JPH071800Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP16649388U 1988-12-23 1988-12-23 半導体装置 Expired - Lifetime JPH071800Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16649388U JPH071800Y2 (ja) 1988-12-23 1988-12-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16649388U JPH071800Y2 (ja) 1988-12-23 1988-12-23 半導体装置

Publications (2)

Publication Number Publication Date
JPH0286142U JPH0286142U (en, 2012) 1990-07-09
JPH071800Y2 true JPH071800Y2 (ja) 1995-01-18

Family

ID=31453923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16649388U Expired - Lifetime JPH071800Y2 (ja) 1988-12-23 1988-12-23 半導体装置

Country Status (1)

Country Link
JP (1) JPH071800Y2 (en, 2012)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014207261A (ja) * 2013-04-10 2014-10-30 株式会社デンソー 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPH0286142U (en, 2012) 1990-07-09

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term