JPH071791Y2 - 半導体ウエハ取外装置 - Google Patents

半導体ウエハ取外装置

Info

Publication number
JPH071791Y2
JPH071791Y2 JP1988138323U JP13832388U JPH071791Y2 JP H071791 Y2 JPH071791 Y2 JP H071791Y2 JP 1988138323 U JP1988138323 U JP 1988138323U JP 13832388 U JP13832388 U JP 13832388U JP H071791 Y2 JPH071791 Y2 JP H071791Y2
Authority
JP
Japan
Prior art keywords
wafer
polishing jig
jig
wax
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988138323U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0258331U (enrdf_load_html_response
Inventor
誠 小沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP1988138323U priority Critical patent/JPH071791Y2/ja
Publication of JPH0258331U publication Critical patent/JPH0258331U/ja
Application granted granted Critical
Publication of JPH071791Y2 publication Critical patent/JPH071791Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
JP1988138323U 1988-10-24 1988-10-24 半導体ウエハ取外装置 Expired - Lifetime JPH071791Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988138323U JPH071791Y2 (ja) 1988-10-24 1988-10-24 半導体ウエハ取外装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988138323U JPH071791Y2 (ja) 1988-10-24 1988-10-24 半導体ウエハ取外装置

Publications (2)

Publication Number Publication Date
JPH0258331U JPH0258331U (enrdf_load_html_response) 1990-04-26
JPH071791Y2 true JPH071791Y2 (ja) 1995-01-18

Family

ID=31400553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988138323U Expired - Lifetime JPH071791Y2 (ja) 1988-10-24 1988-10-24 半導体ウエハ取外装置

Country Status (1)

Country Link
JP (1) JPH071791Y2 (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012081611A1 (ja) * 2010-12-14 2012-06-21 住友ベークライト株式会社 基材の加工方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612735A (en) * 1979-07-10 1981-02-07 Nec Corp Peeling of monocrystalline wafer
JPS56161340U (enrdf_load_html_response) * 1980-04-28 1981-12-01

Also Published As

Publication number Publication date
JPH0258331U (enrdf_load_html_response) 1990-04-26

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