JPH0258331U - - Google Patents

Info

Publication number
JPH0258331U
JPH0258331U JP13832388U JP13832388U JPH0258331U JP H0258331 U JPH0258331 U JP H0258331U JP 13832388 U JP13832388 U JP 13832388U JP 13832388 U JP13832388 U JP 13832388U JP H0258331 U JPH0258331 U JP H0258331U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
removal device
jig
cooling
wafer removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13832388U
Other languages
English (en)
Japanese (ja)
Other versions
JPH071791Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988138323U priority Critical patent/JPH071791Y2/ja
Publication of JPH0258331U publication Critical patent/JPH0258331U/ja
Application granted granted Critical
Publication of JPH071791Y2 publication Critical patent/JPH071791Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
JP1988138323U 1988-10-24 1988-10-24 半導体ウエハ取外装置 Expired - Lifetime JPH071791Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988138323U JPH071791Y2 (ja) 1988-10-24 1988-10-24 半導体ウエハ取外装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988138323U JPH071791Y2 (ja) 1988-10-24 1988-10-24 半導体ウエハ取外装置

Publications (2)

Publication Number Publication Date
JPH0258331U true JPH0258331U (enrdf_load_html_response) 1990-04-26
JPH071791Y2 JPH071791Y2 (ja) 1995-01-18

Family

ID=31400553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988138323U Expired - Lifetime JPH071791Y2 (ja) 1988-10-24 1988-10-24 半導体ウエハ取外装置

Country Status (1)

Country Link
JP (1) JPH071791Y2 (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012081611A1 (ja) * 2010-12-14 2012-06-21 住友ベークライト株式会社 基材の加工方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612735A (en) * 1979-07-10 1981-02-07 Nec Corp Peeling of monocrystalline wafer
JPS56161340U (enrdf_load_html_response) * 1980-04-28 1981-12-01

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612735A (en) * 1979-07-10 1981-02-07 Nec Corp Peeling of monocrystalline wafer
JPS56161340U (enrdf_load_html_response) * 1980-04-28 1981-12-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012081611A1 (ja) * 2010-12-14 2012-06-21 住友ベークライト株式会社 基材の加工方法

Also Published As

Publication number Publication date
JPH071791Y2 (ja) 1995-01-18

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