JPH0715139Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0715139Y2 JPH0715139Y2 JP1986179913U JP17991386U JPH0715139Y2 JP H0715139 Y2 JPH0715139 Y2 JP H0715139Y2 JP 1986179913 U JP1986179913 U JP 1986179913U JP 17991386 U JP17991386 U JP 17991386U JP H0715139 Y2 JPH0715139 Y2 JP H0715139Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- recess
- pellet
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986179913U JPH0715139Y2 (ja) | 1986-11-21 | 1986-11-21 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986179913U JPH0715139Y2 (ja) | 1986-11-21 | 1986-11-21 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6384958U JPS6384958U (US07655688-20100202-C00086.png) | 1988-06-03 |
JPH0715139Y2 true JPH0715139Y2 (ja) | 1995-04-10 |
Family
ID=31123395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986179913U Expired - Lifetime JPH0715139Y2 (ja) | 1986-11-21 | 1986-11-21 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0715139Y2 (US07655688-20100202-C00086.png) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56114546U (US07655688-20100202-C00086.png) * | 1980-02-04 | 1981-09-03 | ||
JPS6045042A (ja) * | 1983-08-23 | 1985-03-11 | Matsushita Electronics Corp | 半導体パッケ−ジ |
-
1986
- 1986-11-21 JP JP1986179913U patent/JPH0715139Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS6384958U (US07655688-20100202-C00086.png) | 1988-06-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH02114658A (ja) | 半導体装置 | |
US10840164B2 (en) | Wire bonded package with single piece exposed heat slug and leads | |
US4981776A (en) | Method of manufacturing a plastic encapsulated semiconductor device with insulated heat sink | |
JPS59117244A (ja) | 半導体装置 | |
JPH0715139Y2 (ja) | 半導体装置 | |
JPH02307251A (ja) | 樹脂封止型半導体装置 | |
JPH073848B2 (ja) | 半導体装置 | |
JP2518775Y2 (ja) | 半導体装置 | |
JPH0472640U (US07655688-20100202-C00086.png) | ||
JPH05206319A (ja) | 半導体装置およびその製造方法 | |
JPH01273339A (ja) | 樹脂封止型半導体装置 | |
JPH05335444A (ja) | モールドパッケージ | |
JP3057619U (ja) | 放熱部品を具えた半導体パッケージ | |
JPS6380850U (US07655688-20100202-C00086.png) | ||
JPH04273154A (ja) | 半導体装置 | |
JP2000068439A (ja) | 樹脂封止型半導体装置 | |
JPS5977241U (ja) | 樹脂封止型半導体装置 | |
JPH04196471A (ja) | 半導体装置 | |
KR0132905Y1 (ko) | 열방출 반도체 패키지 | |
JPH06196596A (ja) | 半導体装置 | |
JPS61199650A (ja) | 半導体装置 | |
JPH0722547A (ja) | 半導体装置 | |
JPH04241444A (ja) | 半導体装置 | |
JPH0314229B2 (US07655688-20100202-C00086.png) | ||
JPS6257107B2 (US07655688-20100202-C00086.png) |