JPH0713232Y2 - サーディップ型半導体装置 - Google Patents

サーディップ型半導体装置

Info

Publication number
JPH0713232Y2
JPH0713232Y2 JP1988101226U JP10122688U JPH0713232Y2 JP H0713232 Y2 JPH0713232 Y2 JP H0713232Y2 JP 1988101226 U JP1988101226 U JP 1988101226U JP 10122688 U JP10122688 U JP 10122688U JP H0713232 Y2 JPH0713232 Y2 JP H0713232Y2
Authority
JP
Japan
Prior art keywords
recognition
lead
melting point
point glass
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988101226U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0224556U (enExample
Inventor
健二 菅原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1988101226U priority Critical patent/JPH0713232Y2/ja
Publication of JPH0224556U publication Critical patent/JPH0224556U/ja
Application granted granted Critical
Publication of JPH0713232Y2 publication Critical patent/JPH0713232Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988101226U 1988-07-30 1988-07-30 サーディップ型半導体装置 Expired - Lifetime JPH0713232Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988101226U JPH0713232Y2 (ja) 1988-07-30 1988-07-30 サーディップ型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988101226U JPH0713232Y2 (ja) 1988-07-30 1988-07-30 サーディップ型半導体装置

Publications (2)

Publication Number Publication Date
JPH0224556U JPH0224556U (enExample) 1990-02-19
JPH0713232Y2 true JPH0713232Y2 (ja) 1995-03-29

Family

ID=31330028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988101226U Expired - Lifetime JPH0713232Y2 (ja) 1988-07-30 1988-07-30 サーディップ型半導体装置

Country Status (1)

Country Link
JP (1) JPH0713232Y2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0723961Y2 (ja) * 1988-10-14 1995-05-31 京セラ株式会社 半導体素子収納用パッケージ
JP2572461Y2 (ja) * 1991-03-15 1998-05-25 ソニー株式会社 サーディップタイプ固体撮像素子のインナーリード形状

Also Published As

Publication number Publication date
JPH0224556U (enExample) 1990-02-19

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