JPH0711485Y2 - チップ部品の接続固定装置 - Google Patents
チップ部品の接続固定装置Info
- Publication number
- JPH0711485Y2 JPH0711485Y2 JP14343289U JP14343289U JPH0711485Y2 JP H0711485 Y2 JPH0711485 Y2 JP H0711485Y2 JP 14343289 U JP14343289 U JP 14343289U JP 14343289 U JP14343289 U JP 14343289U JP H0711485 Y2 JPH0711485 Y2 JP H0711485Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- pieces
- chip
- insulating substrate
- hook
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 21
- 238000005452 bending Methods 0.000 claims description 10
- 238000005476 soldering Methods 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005339 levitation Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Insertion Pins And Rivets (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14343289U JPH0711485Y2 (ja) | 1989-12-12 | 1989-12-12 | チップ部品の接続固定装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14343289U JPH0711485Y2 (ja) | 1989-12-12 | 1989-12-12 | チップ部品の接続固定装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0381412U JPH0381412U (enrdf_load_stackoverflow) | 1991-08-20 |
| JPH0711485Y2 true JPH0711485Y2 (ja) | 1995-03-15 |
Family
ID=31690206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14343289U Expired - Lifetime JPH0711485Y2 (ja) | 1989-12-12 | 1989-12-12 | チップ部品の接続固定装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0711485Y2 (enrdf_load_stackoverflow) |
-
1989
- 1989-12-12 JP JP14343289U patent/JPH0711485Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0381412U (enrdf_load_stackoverflow) | 1991-08-20 |
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