JPH07106468A - 液体を含有する微小電子デバイス・パッケージとその方法 - Google Patents

液体を含有する微小電子デバイス・パッケージとその方法

Info

Publication number
JPH07106468A
JPH07106468A JP6232428A JP23242894A JPH07106468A JP H07106468 A JPH07106468 A JP H07106468A JP 6232428 A JP6232428 A JP 6232428A JP 23242894 A JP23242894 A JP 23242894A JP H07106468 A JPH07106468 A JP H07106468A
Authority
JP
Japan
Prior art keywords
liquid
sealant
substrate
lid
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6232428A
Other languages
English (en)
Japanese (ja)
Inventor
Brian A Webb
ブライアン・エー・ウエッブ
Robert M Wentworth
ロバート・エム・ウエントワース
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of JPH07106468A publication Critical patent/JPH07106468A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/22—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device liquid at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/54—Providing fillings in containers, e.g. gas fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Micromachines (AREA)
JP6232428A 1993-09-13 1994-09-02 液体を含有する微小電子デバイス・パッケージとその方法 Pending JPH07106468A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US119555 1993-09-13
US08/119,555 US5413965A (en) 1993-09-13 1993-09-13 Method of making microelectronic device package containing a liquid

Publications (1)

Publication Number Publication Date
JPH07106468A true JPH07106468A (ja) 1995-04-21

Family

ID=22385036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6232428A Pending JPH07106468A (ja) 1993-09-13 1994-09-02 液体を含有する微小電子デバイス・パッケージとその方法

Country Status (6)

Country Link
US (2) US5413965A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (2) EP0952610A3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPH07106468A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR950010028A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN (1) CN1034702C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW263610B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6572236B2 (en) 2000-04-26 2003-06-03 International Business Machines Corporation Back light unit, liquid crystal display, and method for manufacturing light guide plate

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2699365B1 (fr) * 1992-12-16 1995-02-10 Alcatel Telspace Système de dissipation de l'énergie calorifique dégagée par un composant électronique.
US5716763A (en) * 1994-12-06 1998-02-10 International Business Machines Corporation Liquid immersion heating process for substrate temperature uniformity
US5625227A (en) * 1995-01-18 1997-04-29 Dell Usa, L.P. Circuit board-mounted IC package cooling apparatus
WO1997007509A1 (en) * 1995-08-21 1997-02-27 Matsushita Electric Industrial Co., Ltd. Multimedia optical disk capable of preserving freshness of image content for long time and its reproduction apparatus and method
US6144157A (en) * 1998-05-18 2000-11-07 Motorola, Inc. Organic EL device with fluorocarbon liquid and UV epoxy layers and method
JP2000357766A (ja) * 1999-06-14 2000-12-26 Hitachi Ltd モジュール内への液体冷媒の封止方法
US6525420B2 (en) 2001-01-30 2003-02-25 Thermal Corp. Semiconductor package with lid heat spreader
US7581585B2 (en) 2004-10-29 2009-09-01 3M Innovative Properties Company Variable position cooling apparatus
US20080266801A1 (en) * 2007-04-30 2008-10-30 Rockwell Automation Technologies, Inc. Phase change cooled power electronic module
US8324719B2 (en) * 2009-08-31 2012-12-04 General Electric Company Electronic package system

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4323914A (en) * 1979-02-01 1982-04-06 International Business Machines Corporation Heat transfer structure for integrated circuit package
JPS56164543A (en) * 1980-05-23 1981-12-17 Hitachi Ltd Manufacture of semiconductor device
JPS607739A (ja) * 1983-06-27 1985-01-16 Nec Corp 半導体装置の製造方法
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US4730665A (en) * 1983-07-14 1988-03-15 Technology Enterprises Company Apparatus for cooling high-density integrated circuit packages
JPS6037756A (ja) * 1983-08-10 1985-02-27 Mitsubishi Electric Corp 半導体装置
JPS60183743A (ja) * 1984-03-01 1985-09-19 Hitachi Chem Co Ltd 半導体類のパツケ−ジ成形方法
JPS61125057A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd 半導体装置
US5126919A (en) * 1985-10-04 1992-06-30 Fujitsu Limited Cooling system for an electronic circuit device
JPS6396945A (ja) * 1986-10-14 1988-04-27 Nippon Denso Co Ltd 大電力用半導体装置
US4721996A (en) * 1986-10-14 1988-01-26 Unisys Corporation Spring loaded module for cooling integrated circuit packages directly with a liquid
JPS63116461A (ja) * 1986-11-05 1988-05-20 Tomoegawa Paper Co Ltd 固体撮像装置の気密封止方法
US4961106A (en) * 1987-03-27 1990-10-02 Olin Corporation Metal packages having improved thermal dissipation
JPS63284837A (ja) * 1987-05-18 1988-11-22 Hitachi Ltd 半導体素子の冷却構造
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
JPH01291452A (ja) * 1988-05-19 1989-11-24 Sanyo Electric Co Ltd 半導体装置の製造方法
US5050036A (en) * 1989-10-24 1991-09-17 Amdahl Corporation Liquid cooled integrated circuit assembly
JPH03296237A (ja) * 1990-04-16 1991-12-26 Hitachi Ltd 熱伝導用半導体チップの背面接合方法およびそれを用いた半導体装置
US5097387A (en) * 1990-06-27 1992-03-17 Digital Equipment Corporation Circuit chip package employing low melting point solder for heat transfer
JP2515923B2 (ja) * 1990-11-15 1996-07-10 九州日本電気株式会社 半導体装置の封止方法
JP2867753B2 (ja) * 1991-02-25 1999-03-10 富士電機株式会社 半導体装置
JPH04312962A (ja) * 1991-03-18 1992-11-04 Mitsubishi Electric Corp 液体封止半導体装置及びその組立方法
US5210440A (en) * 1991-06-03 1993-05-11 Vlsi Technology, Inc. Semiconductor chip cooling apparatus
JP2995590B2 (ja) * 1991-06-26 1999-12-27 株式会社日立製作所 半導体冷却装置
JPH05251578A (ja) * 1992-03-05 1993-09-28 Hitachi Ltd 接合方法および接合装置
US5305184A (en) * 1992-12-16 1994-04-19 Ibm Corporation Method and apparatus for immersion cooling or an electronic board
US5323294A (en) * 1993-03-31 1994-06-21 Unisys Corporation Liquid metal heat conducting member and integrated circuit package incorporating same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6572236B2 (en) 2000-04-26 2003-06-03 International Business Machines Corporation Back light unit, liquid crystal display, and method for manufacturing light guide plate

Also Published As

Publication number Publication date
CN1109219A (zh) 1995-09-27
EP0952610A3 (en) 2000-05-17
EP0644592A1 (en) 1995-03-22
EP0952610A2 (en) 1999-10-27
CN1034702C (zh) 1997-04-23
US5413965A (en) 1995-05-09
US5477084A (en) 1995-12-19
KR950010028A (ko) 1995-04-26
TW263610B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1995-11-21

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