JPH0710495Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0710495Y2 JPH0710495Y2 JP4036889U JP4036889U JPH0710495Y2 JP H0710495 Y2 JPH0710495 Y2 JP H0710495Y2 JP 4036889 U JP4036889 U JP 4036889U JP 4036889 U JP4036889 U JP 4036889U JP H0710495 Y2 JPH0710495 Y2 JP H0710495Y2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- alumina ceramic
- metallized portion
- semiconductor device
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4036889U JPH0710495Y2 (ja) | 1989-04-04 | 1989-04-04 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4036889U JPH0710495Y2 (ja) | 1989-04-04 | 1989-04-04 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02131353U JPH02131353U (cs) | 1990-10-31 |
JPH0710495Y2 true JPH0710495Y2 (ja) | 1995-03-08 |
Family
ID=31550097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4036889U Expired - Lifetime JPH0710495Y2 (ja) | 1989-04-04 | 1989-04-04 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0710495Y2 (cs) |
-
1989
- 1989-04-04 JP JP4036889U patent/JPH0710495Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02131353U (cs) | 1990-10-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3009788B2 (ja) | 集積回路用パッケージ | |
US5436407A (en) | Metal semiconductor package with an external plastic seal | |
JPH0710495Y2 (ja) | 半導体装置 | |
JPS62264659A (ja) | 固体撮像装置 | |
JPS59111350A (ja) | 半導体装置 | |
JP3445761B2 (ja) | 電子デバイス用セラミックパッケージ | |
JP3051225B2 (ja) | 集積回路用パッケージ | |
JPH0287655A (ja) | 半導体装置 | |
JPS6365649A (ja) | 半導体用パツケ−ジ | |
KR100641511B1 (ko) | 고집적 반도체 패키지 및 그 제조 방법 | |
JP2663645B2 (ja) | マイクロ波帯のセラミック複合モジュール | |
JPH05315461A (ja) | 封止型電子部品および封止型電子部品の製造方法 | |
JPH0316986A (ja) | 半導体装置 | |
JPH0433357A (ja) | マルチ・チップ・パッケージの構造 | |
JPH02306657A (ja) | 半導体装置 | |
JPH0613478A (ja) | 半導体装置封止用セラミックス構造体およびその製造方法ならびにそのふた材 | |
JPH0457357A (ja) | 集積回路装置 | |
JPH098171A (ja) | 半導体パッケージ | |
JPS60200544A (ja) | 混成集積回路素子 | |
JPH07122666A (ja) | 半導体素子収納用パッケージ | |
JP2004296725A (ja) | 電子部品収納用パッケージ | |
JPH0774279A (ja) | 電子部品 | |
JPH04267360A (ja) | 半導体装置 | |
JPH0661386A (ja) | 半導体装置 | |
JPH0794670A (ja) | 混成集積回路装置 |