JPH066508Y2 - 接着剤収納容器保持装置 - Google Patents

接着剤収納容器保持装置

Info

Publication number
JPH066508Y2
JPH066508Y2 JP11389585U JP11389585U JPH066508Y2 JP H066508 Y2 JPH066508 Y2 JP H066508Y2 JP 11389585 U JP11389585 U JP 11389585U JP 11389585 U JP11389585 U JP 11389585U JP H066508 Y2 JPH066508 Y2 JP H066508Y2
Authority
JP
Japan
Prior art keywords
adhesive
container
holding device
storage container
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP11389585U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6224976U (enrdf_load_stackoverflow
Inventor
幸生 山田
和人 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Japan Radio Co Ltd
Original Assignee
New Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Japan Radio Co Ltd filed Critical New Japan Radio Co Ltd
Priority to JP11389585U priority Critical patent/JPH066508Y2/ja
Publication of JPS6224976U publication Critical patent/JPS6224976U/ja
Application granted granted Critical
Publication of JPH066508Y2 publication Critical patent/JPH066508Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
  • Die Bonding (AREA)
JP11389585U 1985-07-25 1985-07-25 接着剤収納容器保持装置 Expired - Lifetime JPH066508Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11389585U JPH066508Y2 (ja) 1985-07-25 1985-07-25 接着剤収納容器保持装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11389585U JPH066508Y2 (ja) 1985-07-25 1985-07-25 接着剤収納容器保持装置

Publications (2)

Publication Number Publication Date
JPS6224976U JPS6224976U (enrdf_load_stackoverflow) 1987-02-16
JPH066508Y2 true JPH066508Y2 (ja) 1994-02-16

Family

ID=30996123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11389585U Expired - Lifetime JPH066508Y2 (ja) 1985-07-25 1985-07-25 接着剤収納容器保持装置

Country Status (1)

Country Link
JP (1) JPH066508Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5187895B2 (ja) * 2008-07-31 2013-04-24 武蔵エンジニアリング株式会社 ノズル位置補正機構およびそれを備える塗布装置

Also Published As

Publication number Publication date
JPS6224976U (enrdf_load_stackoverflow) 1987-02-16

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