JPH06510164A - レーザートリミング法およびそれを利用して製造された集積回路 - Google Patents

レーザートリミング法およびそれを利用して製造された集積回路

Info

Publication number
JPH06510164A
JPH06510164A JP4511420A JP51142092A JPH06510164A JP H06510164 A JPH06510164 A JP H06510164A JP 4511420 A JP4511420 A JP 4511420A JP 51142092 A JP51142092 A JP 51142092A JP H06510164 A JPH06510164 A JP H06510164A
Authority
JP
Japan
Prior art keywords
insulating layer
interconnect
level
etch stop
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4511420A
Other languages
English (en)
Japanese (ja)
Inventor
リツピツト，マツクスウェル　ダブリュ，ザ　サード
Original Assignee
ハリス　コーポレーシヨン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24769251&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH06510164(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by ハリス　コーポレーシヨン filed Critical ハリス　コーポレーシヨン
Publication of JPH06510164A publication Critical patent/JPH06510164A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W20/066—
    • H10W20/068—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/093—Laser beam treatment in general
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/94—Laser ablative material removal

Landscapes

  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP4511420A 1991-04-23 1992-04-23 レーザートリミング法およびそれを利用して製造された集積回路 Pending JPH06510164A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/689,624 US5096850A (en) 1991-04-23 1991-04-23 Method of laser trimming
US689,624 1991-04-23
PCT/US1992/003354 WO1992019009A1 (en) 1991-04-23 1992-04-23 Method of laser trimming and resulting ic

Publications (1)

Publication Number Publication Date
JPH06510164A true JPH06510164A (ja) 1994-11-10

Family

ID=24769251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4511420A Pending JPH06510164A (ja) 1991-04-23 1992-04-23 レーザートリミング法およびそれを利用して製造された集積回路

Country Status (4)

Country Link
US (1) US5096850A (enExample)
EP (1) EP0581867A1 (enExample)
JP (1) JPH06510164A (enExample)
WO (1) WO1992019009A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7566594B2 (en) 2006-08-31 2009-07-28 Oki Semiconductor Co., Ltd. Fabricating method of semiconductor device

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5284794A (en) * 1990-02-21 1994-02-08 Nippondenso Co., Ltd. Method of making semiconductor device using a trimmable thin-film resistor
US5345361A (en) * 1992-08-24 1994-09-06 Murata Erie North America, Inc. Shorted trimmable composite multilayer capacitor and method
US5265114C1 (en) * 1992-09-10 2001-08-21 Electro Scient Ind Inc System and method for selectively laser processing a target structure of one or more materials of a multimaterial multilayer device
US5374590A (en) * 1993-04-28 1994-12-20 International Business Machines Corporation Fabrication and laser deletion of microfuses
JP2993339B2 (ja) * 1993-12-03 1999-12-20 ヤマハ株式会社 半導体装置の製造方法
US5685995A (en) * 1994-11-22 1997-11-11 Electro Scientific Industries, Inc. Method for laser functional trimming of films and devices
EP0762498A3 (en) * 1995-08-28 1998-06-24 International Business Machines Corporation Fuse window with controlled fuse oxide thickness
US5821160A (en) * 1996-06-06 1998-10-13 Motorola, Inc. Method for forming a laser alterable fuse area of a memory cell using an etch stop layer
US5874369A (en) * 1996-12-05 1999-02-23 International Business Machines Corporation Method for forming vias in a dielectric film
US6025256A (en) * 1997-01-06 2000-02-15 Electro Scientific Industries, Inc. Laser based method and system for integrated circuit repair or reconfiguration
WO1999019905A1 (en) 1997-10-13 1999-04-22 Fujitsu Limited Semiconductor device having fuse and fabrication method thereof
US6677226B1 (en) 1998-05-11 2004-01-13 Motorola, Inc. Method for forming an integrated circuit having a bonding pad and a fuse
US6057180A (en) * 1998-06-05 2000-05-02 Electro Scientific Industries, Inc. Method of severing electrically conductive links with ultraviolet laser output
US6217151B1 (en) 1998-06-18 2001-04-17 Xerox Corporation Controlling AIP print uniformity by adjusting row electrode area and shape
US7238620B1 (en) 2004-02-18 2007-07-03 National Semiconductor Corporation System and method for providing a uniform oxide layer over a laser trimmed fuse with a differential wet etch stop technique

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL86162A (en) * 1988-04-25 1991-11-21 Zvi Orbach Customizable semiconductor devices
US4764485A (en) * 1987-01-05 1988-08-16 General Electric Company Method for producing via holes in polymer dielectrics
IL81849A0 (en) * 1987-03-10 1987-10-20 Zvi Orbach Integrated circuits and a method for manufacture thereof
JPH0350756A (ja) * 1989-07-18 1991-03-05 Nec Corp 半導体集積回路の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7566594B2 (en) 2006-08-31 2009-07-28 Oki Semiconductor Co., Ltd. Fabricating method of semiconductor device

Also Published As

Publication number Publication date
US5096850A (en) 1992-03-17
EP0581867A4 (enExample) 1994-03-09
WO1992019009A1 (en) 1992-10-29
EP0581867A1 (en) 1994-02-09

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