JPH064578Y2 - 樹脂封止形半導体装置 - Google Patents

樹脂封止形半導体装置

Info

Publication number
JPH064578Y2
JPH064578Y2 JP14669288U JP14669288U JPH064578Y2 JP H064578 Y2 JPH064578 Y2 JP H064578Y2 JP 14669288 U JP14669288 U JP 14669288U JP 14669288 U JP14669288 U JP 14669288U JP H064578 Y2 JPH064578 Y2 JP H064578Y2
Authority
JP
Japan
Prior art keywords
resin
chip
semiconductor device
island
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP14669288U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0267638U (US06559137-20030506-C00071.png
Inventor
文男 村山
満 金井
克実 大栗
高安 野本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP14669288U priority Critical patent/JPH064578Y2/ja
Publication of JPH0267638U publication Critical patent/JPH0267638U/ja
Application granted granted Critical
Publication of JPH064578Y2 publication Critical patent/JPH064578Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP14669288U 1988-11-10 1988-11-10 樹脂封止形半導体装置 Expired - Lifetime JPH064578Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14669288U JPH064578Y2 (ja) 1988-11-10 1988-11-10 樹脂封止形半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14669288U JPH064578Y2 (ja) 1988-11-10 1988-11-10 樹脂封止形半導体装置

Publications (2)

Publication Number Publication Date
JPH0267638U JPH0267638U (US06559137-20030506-C00071.png) 1990-05-22
JPH064578Y2 true JPH064578Y2 (ja) 1994-02-02

Family

ID=31416420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14669288U Expired - Lifetime JPH064578Y2 (ja) 1988-11-10 1988-11-10 樹脂封止形半導体装置

Country Status (1)

Country Link
JP (1) JPH064578Y2 (US06559137-20030506-C00071.png)

Also Published As

Publication number Publication date
JPH0267638U (US06559137-20030506-C00071.png) 1990-05-22

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