JPH0644110Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0644110Y2
JPH0644110Y2 JP1988134485U JP13448588U JPH0644110Y2 JP H0644110 Y2 JPH0644110 Y2 JP H0644110Y2 JP 1988134485 U JP1988134485 U JP 1988134485U JP 13448588 U JP13448588 U JP 13448588U JP H0644110 Y2 JPH0644110 Y2 JP H0644110Y2
Authority
JP
Japan
Prior art keywords
support plate
mounting portion
mounting
semiconductor element
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988134485U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0256451U (enExample
Inventor
晃 長谷川
経良 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Denso Co Ltd
Sanken Electric Co Ltd
Original Assignee
Toyo Denso Co Ltd
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Denso Co Ltd, Sanken Electric Co Ltd filed Critical Toyo Denso Co Ltd
Priority to JP1988134485U priority Critical patent/JPH0644110Y2/ja
Publication of JPH0256451U publication Critical patent/JPH0256451U/ja
Application granted granted Critical
Publication of JPH0644110Y2 publication Critical patent/JPH0644110Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP1988134485U 1988-10-17 1988-10-17 半導体装置 Expired - Lifetime JPH0644110Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988134485U JPH0644110Y2 (ja) 1988-10-17 1988-10-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988134485U JPH0644110Y2 (ja) 1988-10-17 1988-10-17 半導体装置

Publications (2)

Publication Number Publication Date
JPH0256451U JPH0256451U (enExample) 1990-04-24
JPH0644110Y2 true JPH0644110Y2 (ja) 1994-11-14

Family

ID=31393283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988134485U Expired - Lifetime JPH0644110Y2 (ja) 1988-10-17 1988-10-17 半導体装置

Country Status (1)

Country Link
JP (1) JPH0644110Y2 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831424U (ja) * 1981-08-25 1983-03-01 カルソニックカンセイ株式会社 たわみ軸の潤滑油上り防止装置

Also Published As

Publication number Publication date
JPH0256451U (enExample) 1990-04-24

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