JPH0642475B2 - 多層セラミック被膜の形成方法 - Google Patents

多層セラミック被膜の形成方法

Info

Publication number
JPH0642475B2
JPH0642475B2 JP30161687A JP30161687A JPH0642475B2 JP H0642475 B2 JPH0642475 B2 JP H0642475B2 JP 30161687 A JP30161687 A JP 30161687A JP 30161687 A JP30161687 A JP 30161687A JP H0642475 B2 JPH0642475 B2 JP H0642475B2
Authority
JP
Japan
Prior art keywords
coating
ceramic
electronic device
preceramic
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP30161687A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63152130A (ja
Inventor
アンドリュー ハルスカ ローレン
ウィントン マイケル キース
ターヘイ レオ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of JPS63152130A publication Critical patent/JPS63152130A/ja
Publication of JPH0642475B2 publication Critical patent/JPH0642475B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/122—Inorganic polymers, e.g. silanes, polysilazanes, polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)
JP30161687A 1986-12-04 1987-12-01 多層セラミック被膜の形成方法 Expired - Lifetime JPH0642475B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US938678 1986-12-04
US06/938,678 US4911992A (en) 1986-12-04 1986-12-04 Platinum or rhodium catalyzed multilayer ceramic coatings from hydrogen silsesquioxane resin and metal oxides

Publications (2)

Publication Number Publication Date
JPS63152130A JPS63152130A (ja) 1988-06-24
JPH0642475B2 true JPH0642475B2 (ja) 1994-06-01

Family

ID=25471788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30161687A Expired - Lifetime JPH0642475B2 (ja) 1986-12-04 1987-12-01 多層セラミック被膜の形成方法

Country Status (7)

Country Link
US (1) US4911992A (de)
EP (1) EP0270231B1 (de)
JP (1) JPH0642475B2 (de)
KR (1) KR950011561B1 (de)
CA (1) CA1284748C (de)
DE (1) DE3784645T2 (de)
ES (1) ES2010234A6 (de)

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US5128494A (en) * 1985-04-26 1992-07-07 Sri International Hydridosiloxanes as precursors to ceramic products
KR910003742B1 (ko) * 1986-09-09 1991-06-10 세미콘덕터 에너지 라보라터리 캄파니 리미티드 Cvd장치
US4842888A (en) * 1988-04-07 1989-06-27 Dow Corning Corporation Ceramic coatings from the pyrolysis in ammonia of mixtures of silicate esters and other metal oxide precursors
FR2640619A1 (fr) * 1988-12-20 1990-06-22 Europ Propulsion Procede pour la protection anti-oxydation de produits en materiau composite contenant du carbone, et produits obtenus par le procede
US5336532A (en) * 1989-02-21 1994-08-09 Dow Corning Corporation Low temperature process for the formation of ceramic coatings
US5034358A (en) * 1989-05-05 1991-07-23 Kaman Sciences Corporation Ceramic material and method for producing the same
JPH03115586A (ja) * 1989-09-28 1991-05-16 Nkk Corp セラミック膜の形成方法
US4973526A (en) * 1990-02-15 1990-11-27 Dow Corning Corporation Method of forming ceramic coatings and resulting articles
US5116637A (en) * 1990-06-04 1992-05-26 Dow Corning Corporation Amine catalysts for the low temperature conversion of silica precursors to silica
US5059448A (en) * 1990-06-18 1991-10-22 Dow Corning Corporation Rapid thermal process for obtaining silica coatings
US5118530A (en) * 1990-11-28 1992-06-02 Dow Corning Corporation Use of hydrogen silsesquioxane resin fractions as coating materials
US5380553A (en) * 1990-12-24 1995-01-10 Dow Corning Corporation Reverse direction pyrolysis processing
JPH06737A (ja) * 1991-03-29 1994-01-11 Shin Etsu Chem Co Ltd 静電チャック基板
US5445894A (en) * 1991-04-22 1995-08-29 Dow Corning Corporation Ceramic coatings
US5231061A (en) * 1991-06-10 1993-07-27 The Dow Chemical Company Process for making coated ceramic reinforcement whiskers
US5300322A (en) * 1992-03-10 1994-04-05 Martin Marietta Energy Systems, Inc. Molybdenum enhanced low-temperature deposition of crystalline silicon nitride
US5310583A (en) * 1992-11-02 1994-05-10 Dow Corning Corporation Vapor phase deposition of hydrogen silsesquioxane resin in the presence of nitrous oxide
US5352485A (en) * 1993-04-08 1994-10-04 Case Western Reserve University Synthesis of metal oxide thin films
TW257785B (de) * 1993-05-17 1995-09-21 Dow Corning
US5567661A (en) * 1993-08-26 1996-10-22 Fujitsu Limited Formation of planarized insulating film by plasma-enhanced CVD of organic silicon compound
US5320868A (en) * 1993-09-13 1994-06-14 Dow Corning Corporation Method of forming SI-O containing coatings
US5512351A (en) * 1993-12-28 1996-04-30 Nikkiso Company Limited Prepreg, process for preparation of prepreg, and products derived therefrom
US5863595A (en) * 1996-10-04 1999-01-26 Dow Corning Corporation Thick ceramic coatings for electronic devices
US6015457A (en) * 1997-04-21 2000-01-18 Alliedsignal Inc. Stable inorganic polymers
US6218497B1 (en) 1997-04-21 2001-04-17 Alliedsignal Inc. Organohydridosiloxane resins with low organic content
US6743856B1 (en) 1997-04-21 2004-06-01 Honeywell International Inc. Synthesis of siloxane resins
US6143855A (en) 1997-04-21 2000-11-07 Alliedsignal Inc. Organohydridosiloxane resins with high organic content
US6020458A (en) 1997-10-24 2000-02-01 Quester Technology, Inc. Precursors for making low dielectric constant materials with improved thermal stability
US6051321A (en) 1997-10-24 2000-04-18 Quester Technology, Inc. Low dielectric constant materials and method
US6177199B1 (en) 1999-01-07 2001-01-23 Alliedsignal Inc. Dielectric films from organohydridosiloxane resins with low organic content
US6218020B1 (en) 1999-01-07 2001-04-17 Alliedsignal Inc. Dielectric films from organohydridosiloxane resins with high organic content
WO1999057330A1 (en) * 1998-05-01 1999-11-11 Desu Seshu B Oxide/organic polymer multilayer thin films deposited by chemical vapor deposition
JP2003502449A (ja) * 1999-06-10 2003-01-21 ハネウエル・インターナシヨナル・インコーポレーテツド フォトリソグラフィ用スピンオンガラス反射防止コーティング
US6495208B1 (en) 1999-09-09 2002-12-17 Virginia Tech Intellectual Properties, Inc. Near-room temperature CVD synthesis of organic polymer/oxide dielectric nanocomposites
US6472076B1 (en) 1999-10-18 2002-10-29 Honeywell International Inc. Deposition of organosilsesquioxane films
US6440550B1 (en) 1999-10-18 2002-08-27 Honeywell International Inc. Deposition of fluorosilsesquioxane films
US6368400B1 (en) * 2000-07-17 2002-04-09 Honeywell International Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography
KR20030057133A (ko) * 2001-12-28 2003-07-04 삼성전자주식회사 금속 패턴 형성용 유기금속 전구체 및 이를 이용한 금속패턴 형성방법
US8053159B2 (en) 2003-11-18 2011-11-08 Honeywell International Inc. Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
US8642246B2 (en) * 2007-02-26 2014-02-04 Honeywell International Inc. Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof
US8557877B2 (en) 2009-06-10 2013-10-15 Honeywell International Inc. Anti-reflective coatings for optically transparent substrates
US20120238165A1 (en) * 2009-12-09 2012-09-20 Teijin Aramid B.V. Use of core-shell particles for anti-wicking application of a yarn or fabric
US8864898B2 (en) 2011-05-31 2014-10-21 Honeywell International Inc. Coating formulations for optical elements
US8481626B1 (en) 2012-01-16 2013-07-09 Itron, Inc. Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits
US8728568B2 (en) 2012-01-16 2014-05-20 Itron, Inc. Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier
US20130241390A1 (en) * 2012-03-14 2013-09-19 Peter Guschl Metal-containing encapsulant compositions and methods
CN107896511B (zh) 2015-02-26 2022-02-18 动态太阳能系统公司 用于在室温下生产电工薄层的方法及电工薄层
EP3262675A1 (de) 2015-02-26 2018-01-03 Dynamic Solar Systems AG Raumtemperatur-verfahren zur herstellung elektrotechnischer dünnschichten und verfahrensgemäss erhaltene dünnschichtfolge
JP6803842B2 (ja) 2015-04-13 2020-12-23 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング

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US4340619A (en) * 1981-01-15 1982-07-20 Dow Corning Corporation Process for the preparation of poly(disilyl)silazane polymers and the polymers therefrom
US4312970A (en) * 1981-02-20 1982-01-26 Dow Corning Corporation Silazane polymers from {R'3 Si}2 NH and organochlorosilanes
US4395460A (en) * 1981-09-21 1983-07-26 Dow Corning Corporation Preparation of polysilazane polymers and the polymers therefrom
EP0076656B1 (de) * 1981-10-03 1988-06-01 Japan Synthetic Rubber Co., Ltd. In Lösungsmitteln lösliche Organopolysilsesquioxane, Verfahren zu ihrer Herstellung, Zusammensetzungen und Halbleitervorrichtungen, die diese verwenden
JPS5866335A (ja) * 1981-10-16 1983-04-20 Fujitsu Ltd 集積回路
US4397828A (en) * 1981-11-16 1983-08-09 Massachusetts Institute Of Technology Stable liquid polymeric precursor to silicon nitride and process
CA1204527A (en) * 1982-08-13 1986-05-13 Theodore F. Retajczyk, Jr. Polymeric films for electronic circuits
CA1217927A (en) * 1983-04-15 1987-02-17 Tsutomu Nanao Inorganic composite material and process for preparing the same
JPS6085548A (ja) * 1983-10-17 1985-05-15 Nec Corp 集積回路装置
US4540803A (en) * 1983-11-28 1985-09-10 Dow Corning Corporation Hydrosilazane polymers from [R3 Si]2 NH and HSiCl3
US4543344A (en) * 1983-11-28 1985-09-24 Dow Corning Corporation Silicon nitride-containing ceramic material prepared by pyrolysis of hydrosilazane polymers from (R3 Si)2 NH and HSiCl3
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Also Published As

Publication number Publication date
JPS63152130A (ja) 1988-06-24
CA1284748C (en) 1991-06-11
EP0270231B1 (de) 1993-03-10
ES2010234A6 (es) 1989-11-01
KR950011561B1 (ko) 1995-10-06
DE3784645D1 (de) 1993-04-15
KR890011065A (ko) 1989-08-12
US4911992A (en) 1990-03-27
EP0270231A2 (de) 1988-06-08
DE3784645T2 (de) 1993-09-30
EP0270231A3 (en) 1989-12-13

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