JPH0636592Y2 - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPH0636592Y2
JPH0636592Y2 JP1988136213U JP13621388U JPH0636592Y2 JP H0636592 Y2 JPH0636592 Y2 JP H0636592Y2 JP 1988136213 U JP1988136213 U JP 1988136213U JP 13621388 U JP13621388 U JP 13621388U JP H0636592 Y2 JPH0636592 Y2 JP H0636592Y2
Authority
JP
Japan
Prior art keywords
substrate
signal
conductor
small
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988136213U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0256460U (bg
Inventor
栄寿 前原
雅之 越塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1988136213U priority Critical patent/JPH0636592Y2/ja
Publication of JPH0256460U publication Critical patent/JPH0256460U/ja
Application granted granted Critical
Publication of JPH0636592Y2 publication Critical patent/JPH0636592Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP1988136213U 1988-10-19 1988-10-19 混成集積回路装置 Expired - Lifetime JPH0636592Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988136213U JPH0636592Y2 (ja) 1988-10-19 1988-10-19 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988136213U JPH0636592Y2 (ja) 1988-10-19 1988-10-19 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPH0256460U JPH0256460U (bg) 1990-04-24
JPH0636592Y2 true JPH0636592Y2 (ja) 1994-09-21

Family

ID=31396510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988136213U Expired - Lifetime JPH0636592Y2 (ja) 1988-10-19 1988-10-19 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPH0636592Y2 (bg)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6063622B2 (ja) * 2011-11-24 2017-01-18 株式会社ケーヒン 電子制御装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6241594U (bg) * 1985-04-26 1987-03-12

Also Published As

Publication number Publication date
JPH0256460U (bg) 1990-04-24

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