JPH0636591Y2 - ブリッジ型整流回路装置 - Google Patents

ブリッジ型整流回路装置

Info

Publication number
JPH0636591Y2
JPH0636591Y2 JP1989153032U JP15303289U JPH0636591Y2 JP H0636591 Y2 JPH0636591 Y2 JP H0636591Y2 JP 1989153032 U JP1989153032 U JP 1989153032U JP 15303289 U JP15303289 U JP 15303289U JP H0636591 Y2 JPH0636591 Y2 JP H0636591Y2
Authority
JP
Japan
Prior art keywords
rectifier circuit
circuit device
bridge
reverse recovery
bridge type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989153032U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0392055U (enExample
Inventor
雅之 原田
義幹 菊池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP1989153032U priority Critical patent/JPH0636591Y2/ja
Publication of JPH0392055U publication Critical patent/JPH0392055U/ja
Application granted granted Critical
Publication of JPH0636591Y2 publication Critical patent/JPH0636591Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Rectifiers (AREA)
JP1989153032U 1989-12-29 1989-12-29 ブリッジ型整流回路装置 Expired - Lifetime JPH0636591Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989153032U JPH0636591Y2 (ja) 1989-12-29 1989-12-29 ブリッジ型整流回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989153032U JPH0636591Y2 (ja) 1989-12-29 1989-12-29 ブリッジ型整流回路装置

Publications (2)

Publication Number Publication Date
JPH0392055U JPH0392055U (enExample) 1991-09-19
JPH0636591Y2 true JPH0636591Y2 (ja) 1994-09-21

Family

ID=31699261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989153032U Expired - Lifetime JPH0636591Y2 (ja) 1989-12-29 1989-12-29 ブリッジ型整流回路装置

Country Status (1)

Country Link
JP (1) JPH0636591Y2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5471384B2 (ja) * 2009-12-09 2014-04-16 パナソニック株式会社 電動機駆動用インバータ装置
WO2011048818A1 (ja) * 2009-10-23 2011-04-28 パナソニック株式会社 直流電源装置およびこれを用いた電動機駆動用インバータ装置
JP5471291B2 (ja) * 2009-10-23 2014-04-16 パナソニック株式会社 直流電源装置

Also Published As

Publication number Publication date
JPH0392055U (enExample) 1991-09-19

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term