JPH0631723Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0631723Y2
JPH0631723Y2 JP1986119109U JP11910986U JPH0631723Y2 JP H0631723 Y2 JPH0631723 Y2 JP H0631723Y2 JP 1986119109 U JP1986119109 U JP 1986119109U JP 11910986 U JP11910986 U JP 11910986U JP H0631723 Y2 JPH0631723 Y2 JP H0631723Y2
Authority
JP
Japan
Prior art keywords
semiconductor
finger
semiconductor chip
semiconductor chips
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986119109U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6324840U (it
Inventor
稔 平井
淳司 江口
Original Assignee
ローム 株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ローム 株式会社 filed Critical ローム 株式会社
Priority to JP1986119109U priority Critical patent/JPH0631723Y2/ja
Publication of JPS6324840U publication Critical patent/JPS6324840U/ja
Application granted granted Critical
Publication of JPH0631723Y2 publication Critical patent/JPH0631723Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1986119109U 1986-08-01 1986-08-01 半導体装置 Expired - Lifetime JPH0631723Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986119109U JPH0631723Y2 (ja) 1986-08-01 1986-08-01 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986119109U JPH0631723Y2 (ja) 1986-08-01 1986-08-01 半導体装置

Publications (2)

Publication Number Publication Date
JPS6324840U JPS6324840U (it) 1988-02-18
JPH0631723Y2 true JPH0631723Y2 (ja) 1994-08-22

Family

ID=31006180

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986119109U Expired - Lifetime JPH0631723Y2 (ja) 1986-08-01 1986-08-01 半導体装置

Country Status (1)

Country Link
JP (1) JPH0631723Y2 (it)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030057184A (ko) * 2001-12-28 2003-07-04 동부전자 주식회사 반도체패키지 및 그 제조 방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58106951U (ja) * 1982-01-13 1983-07-21 セイコーエプソン株式会社 半導体集積回路実装構造

Also Published As

Publication number Publication date
JPS6324840U (it) 1988-02-18

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