JPH0631723Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0631723Y2 JPH0631723Y2 JP1986119109U JP11910986U JPH0631723Y2 JP H0631723 Y2 JPH0631723 Y2 JP H0631723Y2 JP 1986119109 U JP1986119109 U JP 1986119109U JP 11910986 U JP11910986 U JP 11910986U JP H0631723 Y2 JPH0631723 Y2 JP H0631723Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- finger
- semiconductor chip
- semiconductor chips
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 73
- 239000000758 substrate Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986119109U JPH0631723Y2 (ja) | 1986-08-01 | 1986-08-01 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986119109U JPH0631723Y2 (ja) | 1986-08-01 | 1986-08-01 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6324840U JPS6324840U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-02-18 |
| JPH0631723Y2 true JPH0631723Y2 (ja) | 1994-08-22 |
Family
ID=31006180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986119109U Expired - Lifetime JPH0631723Y2 (ja) | 1986-08-01 | 1986-08-01 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0631723Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030057184A (ko) * | 2001-12-28 | 2003-07-04 | 동부전자 주식회사 | 반도체패키지 및 그 제조 방법 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58106951U (ja) * | 1982-01-13 | 1983-07-21 | セイコーエプソン株式会社 | 半導体集積回路実装構造 |
-
1986
- 1986-08-01 JP JP1986119109U patent/JPH0631723Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6324840U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-02-18 |