JPH06310638A - 成形パッケージ装置用リードフレーム構造 - Google Patents

成形パッケージ装置用リードフレーム構造

Info

Publication number
JPH06310638A
JPH06310638A JP6059626A JP5962694A JPH06310638A JP H06310638 A JPH06310638 A JP H06310638A JP 6059626 A JP6059626 A JP 6059626A JP 5962694 A JP5962694 A JP 5962694A JP H06310638 A JPH06310638 A JP H06310638A
Authority
JP
Japan
Prior art keywords
lead frame
layer
wire bonding
plated
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP6059626A
Other languages
English (en)
Japanese (ja)
Inventor
Albert Michael Benzoni
マイケル ベンゾニ アルバート
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Publication of JPH06310638A publication Critical patent/JPH06310638A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4835—Cleaning, e.g. removing of solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP6059626A 1993-03-30 1994-03-30 成形パッケージ装置用リードフレーム構造 Withdrawn JPH06310638A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4023693A 1993-03-30 1993-03-30
US040236 1993-03-30

Publications (1)

Publication Number Publication Date
JPH06310638A true JPH06310638A (ja) 1994-11-04

Family

ID=21909897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6059626A Withdrawn JPH06310638A (ja) 1993-03-30 1994-03-30 成形パッケージ装置用リードフレーム構造

Country Status (4)

Country Link
EP (1) EP0620589A1 (enExample)
JP (1) JPH06310638A (enExample)
KR (1) KR940022819A (enExample)
TW (1) TW256946B (enExample)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6396947A (ja) * 1986-10-13 1988-04-27 Mitsubishi Electric Corp 半導体装置用リ−ドフレ−ム
US5070041A (en) * 1988-08-12 1991-12-03 Mitsui Petrochemical Industries, Ltd. Method of removing flash from a semiconductor leadframe using coated leadframe and solvent
US4968397A (en) * 1989-11-27 1990-11-06 Asher Reginald K Non-cyanide electrode cleaning process
JPH0451531A (ja) * 1990-06-19 1992-02-20 Mitsubishi Electric Corp 絶縁封止型半導体装置の製造方法

Also Published As

Publication number Publication date
KR940022819A (ko) 1994-10-21
EP0620589A1 (en) 1994-10-19
TW256946B (enExample) 1995-09-11

Similar Documents

Publication Publication Date Title
US6194777B1 (en) Leadframes with selective palladium plating
US5619068A (en) Externally bondable overmolded package arrangements
US7678706B2 (en) Method of manufacturing a semiconductor device
JPH09252014A (ja) 半導体素子の製造方法
JPH02278740A (ja) 半導体装置のパッケージング方法
US20090098686A1 (en) Method of forming premolded lead frame
US5328552A (en) Leadframe processing for molded package arrangements
CN220510008U (zh) 半导体器件和电子系统
JPH06310638A (ja) 成形パッケージ装置用リードフレーム構造
JPH0745778A (ja) リードフレーム及び半導体装置
JP3424184B2 (ja) 樹脂封止型半導体装置
KR100218320B1 (ko) 버틈 리드 패키지의 제조방법
HK1006374A (en) Leadframe structure for molded package arrangements
JP3013611B2 (ja) 半導体装置の製造方法
KR200157363Y1 (ko) 연결와이어를 사용하지 않고 칩의 본딩패드와 리드프레임의 리드를 접속한 반도체 장치
JP4569048B2 (ja) 面実装型半導体パッケージおよびその製造方法
JPS61241954A (ja) 半導体装置
JPH07249707A (ja) 半導体パッケージ
KR200148753Y1 (ko) 반도체 패키지
JPH03265148A (ja) 半導体装置及びその製造方法
KR100201389B1 (ko) 반도체 패키지
KR100306230B1 (ko) 반도체 패키지 구조
JP3007891B1 (ja) 半導体中空パッケ―ジ及びその製造方法
JPS5823451A (ja) 半導体装置
JPH05335366A (ja) 半導体装置

Legal Events

Date Code Title Description
A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20010605