JPH0627958Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0627958Y2
JPH0627958Y2 JP1988108790U JP10879088U JPH0627958Y2 JP H0627958 Y2 JPH0627958 Y2 JP H0627958Y2 JP 1988108790 U JP1988108790 U JP 1988108790U JP 10879088 U JP10879088 U JP 10879088U JP H0627958 Y2 JPH0627958 Y2 JP H0627958Y2
Authority
JP
Japan
Prior art keywords
lead
circuit board
resin
wire
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988108790U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0229540U (enExample
Inventor
健治 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP1988108790U priority Critical patent/JPH0627958Y2/ja
Publication of JPH0229540U publication Critical patent/JPH0229540U/ja
Application granted granted Critical
Publication of JPH0627958Y2 publication Critical patent/JPH0627958Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1988108790U 1988-08-18 1988-08-18 半導体装置 Expired - Lifetime JPH0627958Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988108790U JPH0627958Y2 (ja) 1988-08-18 1988-08-18 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988108790U JPH0627958Y2 (ja) 1988-08-18 1988-08-18 半導体装置

Publications (2)

Publication Number Publication Date
JPH0229540U JPH0229540U (enExample) 1990-02-26
JPH0627958Y2 true JPH0627958Y2 (ja) 1994-07-27

Family

ID=31344457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988108790U Expired - Lifetime JPH0627958Y2 (ja) 1988-08-18 1988-08-18 半導体装置

Country Status (1)

Country Link
JP (1) JPH0627958Y2 (enExample)

Also Published As

Publication number Publication date
JPH0229540U (enExample) 1990-02-26

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