JPH0229540U - - Google Patents
Info
- Publication number
- JPH0229540U JPH0229540U JP1988108790U JP10879088U JPH0229540U JP H0229540 U JPH0229540 U JP H0229540U JP 1988108790 U JP1988108790 U JP 1988108790U JP 10879088 U JP10879088 U JP 10879088U JP H0229540 U JPH0229540 U JP H0229540U
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- lead wire
- circuit board
- support plate
- thin lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/01515—
-
- H10W72/075—
-
- H10W72/926—
-
- H10W90/753—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988108790U JPH0627958Y2 (ja) | 1988-08-18 | 1988-08-18 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988108790U JPH0627958Y2 (ja) | 1988-08-18 | 1988-08-18 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0229540U true JPH0229540U (enExample) | 1990-02-26 |
| JPH0627958Y2 JPH0627958Y2 (ja) | 1994-07-27 |
Family
ID=31344457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988108790U Expired - Lifetime JPH0627958Y2 (ja) | 1988-08-18 | 1988-08-18 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0627958Y2 (enExample) |
-
1988
- 1988-08-18 JP JP1988108790U patent/JPH0627958Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0627958Y2 (ja) | 1994-07-27 |