JPH0627279Y2 - 集積回路用はんだ - Google Patents

集積回路用はんだ

Info

Publication number
JPH0627279Y2
JPH0627279Y2 JP9199289U JP9199289U JPH0627279Y2 JP H0627279 Y2 JPH0627279 Y2 JP H0627279Y2 JP 9199289 U JP9199289 U JP 9199289U JP 9199289 U JP9199289 U JP 9199289U JP H0627279 Y2 JPH0627279 Y2 JP H0627279Y2
Authority
JP
Japan
Prior art keywords
solder
ribbon
integrated circuit
present
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP9199289U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0331088U (US20110009641A1-20110113-C00116.png
Inventor
裕一 長谷川
朋晋 三井
美城 岩本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uchihashi Estec Co Ltd
Original Assignee
Uchihashi Estec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uchihashi Estec Co Ltd filed Critical Uchihashi Estec Co Ltd
Priority to JP9199289U priority Critical patent/JPH0627279Y2/ja
Publication of JPH0331088U publication Critical patent/JPH0331088U/ja
Application granted granted Critical
Publication of JPH0627279Y2 publication Critical patent/JPH0627279Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP9199289U 1989-08-03 1989-08-03 集積回路用はんだ Expired - Lifetime JPH0627279Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9199289U JPH0627279Y2 (ja) 1989-08-03 1989-08-03 集積回路用はんだ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9199289U JPH0627279Y2 (ja) 1989-08-03 1989-08-03 集積回路用はんだ

Publications (2)

Publication Number Publication Date
JPH0331088U JPH0331088U (US20110009641A1-20110113-C00116.png) 1991-03-26
JPH0627279Y2 true JPH0627279Y2 (ja) 1994-07-27

Family

ID=31641443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9199289U Expired - Lifetime JPH0627279Y2 (ja) 1989-08-03 1989-08-03 集積回路用はんだ

Country Status (1)

Country Link
JP (1) JPH0627279Y2 (US20110009641A1-20110113-C00116.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6891686B2 (ja) * 2017-07-18 2021-06-18 大日本印刷株式会社 シート状ロウ材および熱交換器の製造方法

Also Published As

Publication number Publication date
JPH0331088U (US20110009641A1-20110113-C00116.png) 1991-03-26

Similar Documents

Publication Publication Date Title
US6184109B1 (en) Method of dividing a wafer and method of manufacturing a semiconductor device
US6700178B2 (en) Package of a chip with beveled edges
EP0678904A1 (en) Multicut wafer saw process
JP2005533376A (ja) ウエハ上に超清浄なボンディングパッドを保つための方法およびウエハ
TW200845351A (en) Semiconductor device, leadframe and manufacturing method of semiconductor device
JPH08293476A (ja) 半導体集積回路装置の製造方法および半導体ウエハならびにフォトマスク
US6199743B1 (en) Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
JPH0627279Y2 (ja) 集積回路用はんだ
JP3166122B2 (ja) ワークプレートを使用して結晶を切断する方法
EP1022778A1 (en) Method of dividing a wafer and method of manufacturing a semiconductor device
JPS59220947A (ja) 半導体装置の製造方法
JP3659175B2 (ja) 半導体チップの製造方法および半導体ウエハ
JPH053249A (ja) 半導体装置及びその製造方法
JPH0272638A (ja) 半導体装置の製造方法
JPH03139862A (ja) 半導体装置
KR102327950B1 (ko) 반도체 패키지
JPS63138794A (ja) 半導体レ−ザ素子ダイボンデイング方法
JP3066609B2 (ja) 半導体ウエハ
JPS644339B2 (US20110009641A1-20110113-C00116.png)
JPH10313045A (ja) 半導体チップの保持具
JPH06334069A (ja) ヒートスプレッダを内蔵した半導体パッケージ
JPS5818285Y2 (ja) 板状物の位置決め装置
JP2003115466A (ja) 半導体製造方法、ccdセンサ製造方法、半導体素子、およびccdリニアセンサ
JPS60239086A (ja) 半導体レーザ装置
KR970009272B1 (ko) 반도체의 다이본딩용 픽업툴

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term