JPH0627279Y2 - 集積回路用はんだ - Google Patents
集積回路用はんだInfo
- Publication number
- JPH0627279Y2 JPH0627279Y2 JP9199289U JP9199289U JPH0627279Y2 JP H0627279 Y2 JPH0627279 Y2 JP H0627279Y2 JP 9199289 U JP9199289 U JP 9199289U JP 9199289 U JP9199289 U JP 9199289U JP H0627279 Y2 JPH0627279 Y2 JP H0627279Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- ribbon
- integrated circuit
- present
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9199289U JPH0627279Y2 (ja) | 1989-08-03 | 1989-08-03 | 集積回路用はんだ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9199289U JPH0627279Y2 (ja) | 1989-08-03 | 1989-08-03 | 集積回路用はんだ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0331088U JPH0331088U (US20110009641A1-20110113-C00116.png) | 1991-03-26 |
JPH0627279Y2 true JPH0627279Y2 (ja) | 1994-07-27 |
Family
ID=31641443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9199289U Expired - Lifetime JPH0627279Y2 (ja) | 1989-08-03 | 1989-08-03 | 集積回路用はんだ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0627279Y2 (US20110009641A1-20110113-C00116.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6891686B2 (ja) * | 2017-07-18 | 2021-06-18 | 大日本印刷株式会社 | シート状ロウ材および熱交換器の製造方法 |
-
1989
- 1989-08-03 JP JP9199289U patent/JPH0627279Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0331088U (US20110009641A1-20110113-C00116.png) | 1991-03-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |