JPH0625980Y2 - 混成集積回路 - Google Patents
混成集積回路Info
- Publication number
- JPH0625980Y2 JPH0625980Y2 JP1988108914U JP10891488U JPH0625980Y2 JP H0625980 Y2 JPH0625980 Y2 JP H0625980Y2 JP 1988108914 U JP1988108914 U JP 1988108914U JP 10891488 U JP10891488 U JP 10891488U JP H0625980 Y2 JPH0625980 Y2 JP H0625980Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- hybrid integrated
- integrated circuit
- back surfaces
- tab
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 22
- 239000004020 conductor Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988108914U JPH0625980Y2 (ja) | 1988-08-19 | 1988-08-19 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988108914U JPH0625980Y2 (ja) | 1988-08-19 | 1988-08-19 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0231172U JPH0231172U (cs) | 1990-02-27 |
| JPH0625980Y2 true JPH0625980Y2 (ja) | 1994-07-06 |
Family
ID=31344691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988108914U Expired - Lifetime JPH0625980Y2 (ja) | 1988-08-19 | 1988-08-19 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625980Y2 (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5193433B2 (ja) * | 2006-04-28 | 2013-05-08 | 株式会社東芝 | プリント配線板の数量測定方法、プリント配線板の数量測定システム、プリント配線板、及び電子機器 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0623015Y2 (ja) * | 1986-06-17 | 1994-06-15 | 日本電気株式会社 | 印刷配線板 |
-
1988
- 1988-08-19 JP JP1988108914U patent/JPH0625980Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231172U (cs) | 1990-02-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01251778A (ja) | Icカード | |
| EP1048473B1 (en) | Thermal printhead | |
| JPH0625980Y2 (ja) | 混成集積回路 | |
| JPH0737337Y2 (ja) | 回路部品 | |
| JPS63131593A (ja) | 厚膜回路基板 | |
| JPH065729A (ja) | プリント配線板および半導体素子の位置合わせ方法 | |
| JP2562812Y2 (ja) | ハイブリッド集積回路装置 | |
| JPH0638441Y2 (ja) | 面実装用ハイブリッドicの実装構造 | |
| JP3671436B2 (ja) | 角形チップ部品 | |
| JPH0611531Y2 (ja) | 回路基板装置 | |
| JPS588696Y2 (ja) | 電子部品の保持テ−プ | |
| JPH0142344Y2 (cs) | ||
| JP3629726B2 (ja) | 基板 | |
| JPH06302716A (ja) | 多層基板および多層基板の積層ずれ検出方法 | |
| JPH0510381Y2 (cs) | ||
| JPS6359376U (cs) | ||
| JPH0514548Y2 (cs) | ||
| JPS6292342A (ja) | 表面実装用半導体パツケ−ジ | |
| JPH0119396Y2 (cs) | ||
| JPH0621275U (ja) | フラットパッケージ部品の実装構造 | |
| JPS59141288A (ja) | 混成集積回路装置 | |
| JPH0613741A (ja) | 表面実装部品用回路基板 | |
| JPH0432762Y2 (cs) | ||
| JPH0751808Y2 (ja) | 回路基板のマザーボードに対する取り付け構造 | |
| JPS6155931A (ja) | 厚膜混成集積回路装置の製造方法 |