JPH06236974A - 集積回路の製造方法と、この方法で製造された集積回路 - Google Patents

集積回路の製造方法と、この方法で製造された集積回路

Info

Publication number
JPH06236974A
JPH06236974A JP5276149A JP27614993A JPH06236974A JP H06236974 A JPH06236974 A JP H06236974A JP 5276149 A JP5276149 A JP 5276149A JP 27614993 A JP27614993 A JP 27614993A JP H06236974 A JPH06236974 A JP H06236974A
Authority
JP
Japan
Prior art keywords
layer
floating gate
transistor
integrated circuit
oxidation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5276149A
Other languages
English (en)
Japanese (ja)
Inventor
Andrew J Walker
イアン ウォーカー アンドルー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV, Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of JPH06236974A publication Critical patent/JPH06236974A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/68—Floating-gate IGFETs
    • H10D30/687—Floating-gate IGFETs having more than two programming levels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
    • H10B41/42—Simultaneous manufacture of periphery and memory cells
    • H10B41/43—Simultaneous manufacture of periphery and memory cells comprising only one type of peripheral transistor
    • H10B41/48—Simultaneous manufacture of periphery and memory cells comprising only one type of peripheral transistor with a tunnel dielectric layer also being used as part of the peripheral transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/68—Floating-gate IGFETs
    • H10D30/6891—Floating-gate IGFETs characterised by the shapes, relative sizes or dispositions of the floating gate electrode
    • H10D30/6892—Floating-gate IGFETs characterised by the shapes, relative sizes or dispositions of the floating gate electrode having at least one additional gate other than the floating gate and the control gate, e.g. program gate, erase gate or select gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251—Source or drain electrodes for field-effect devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
JP5276149A 1992-10-07 1993-10-07 集積回路の製造方法と、この方法で製造された集積回路 Pending JPH06236974A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL92203082.0 1992-10-07
EP92203082 1992-10-07

Publications (1)

Publication Number Publication Date
JPH06236974A true JPH06236974A (ja) 1994-08-23

Family

ID=8210951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5276149A Pending JPH06236974A (ja) 1992-10-07 1993-10-07 集積回路の製造方法と、この方法で製造された集積回路

Country Status (7)

Country Link
US (1) US5395778A (en, 2012)
JP (1) JPH06236974A (en, 2012)
KR (1) KR100292159B1 (en, 2012)
CN (1) CN1050934C (en, 2012)
CA (1) CA2107602C (en, 2012)
DE (1) DE69320582T2 (en, 2012)
TW (1) TW237564B (en, 2012)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003511875A (ja) * 1999-10-13 2003-03-25 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド 反射防止膜を備える半導体メモリ装置を製造するための方法
KR100666615B1 (ko) * 2004-04-14 2007-01-09 매그나칩 반도체 유한회사 플래쉬 메모리 소자

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW322591B (en, 2012) * 1996-02-09 1997-12-11 Handotai Energy Kenkyusho Kk
TW347567B (en) * 1996-03-22 1998-12-11 Philips Eloctronics N V Semiconductor device and method of manufacturing a semiconductor device
US6429120B1 (en) 2000-01-18 2002-08-06 Micron Technology, Inc. Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals
TW332342B (en) * 1996-11-11 1998-05-21 Mos Electronics Taiwan Inc Structure and fabrication method of split-gate flash memory
TW360951B (en) * 1997-04-01 1999-06-11 Nxp Bv Method of manufacturing a semiconductor device
US5885871A (en) * 1997-07-31 1999-03-23 Stmicrolelectronics, Inc. Method of making EEPROM cell structure
US6297111B1 (en) * 1997-08-20 2001-10-02 Advanced Micro Devices Self-aligned channel transistor and method for making same
TW420874B (en) 1998-05-04 2001-02-01 Koninkl Philips Electronics Nv Method of manufacturing a semiconductor device
US6159795A (en) * 1998-07-02 2000-12-12 Advanced Micro Devices, Inc. Low voltage junction and high voltage junction optimization for flash memory
US6309936B1 (en) * 1998-09-30 2001-10-30 Advanced Micro Devices, Inc. Integrated formation of LDD and non-LDD semiconductor devices
EP0993036A1 (en) * 1998-10-09 2000-04-12 STMicroelectronics S.r.l. Method of manufacturing an integrated semiconductor device comprising a floating gate field-effect transistor and a logic-field effect transistor, and corresponding device
EP1082760A1 (en) 1999-03-17 2001-03-14 Koninklijke Philips Electronics N.V. Method of manufacturing a floating gate field-effect transistor
US6074908A (en) * 1999-05-26 2000-06-13 Taiwan Semiconductor Manufacturing Company Process for making merged integrated circuits having salicide FETS and embedded DRAM circuits
US6552396B1 (en) * 2000-03-14 2003-04-22 International Business Machines Corporation Matched transistors and methods for forming the same
DE10101270A1 (de) * 2001-01-12 2002-07-25 Infineon Technologies Ag Verfahren zur Herstellung von eingebetteten nichtflüchtigen Halbleiterspeicherzellen
CN100390960C (zh) * 2001-12-31 2008-05-28 台湾茂矽电子股份有限公司 抹除快闪存储阵列存储单元的方法
US7919801B2 (en) * 2007-10-26 2011-04-05 Hvvi Semiconductors, Inc. RF power transistor structure and a method of forming the same
US8133783B2 (en) * 2007-10-26 2012-03-13 Hvvi Semiconductors, Inc. Semiconductor device having different structures formed simultaneously
US8125044B2 (en) * 2007-10-26 2012-02-28 Hvvi Semiconductors, Inc. Semiconductor structure having a unidirectional and a bidirectional device and method of manufacture
US9660044B2 (en) * 2013-09-05 2017-05-23 Nxp Usa, Inc. Power field effect transistor, a power field effect transistor device and a method of manufacturing a power field effect transistor
CN107425069B (zh) * 2017-07-10 2020-04-24 东南大学 面向物联网的有热电转换的soi基ldmos功率管
CN116322047A (zh) * 2023-02-27 2023-06-23 上海华力集成电路制造有限公司 一种兼容半浮栅器件和逻辑器件的制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974677A (ja) * 1982-10-22 1984-04-27 Ricoh Co Ltd 半導体装置及びその製造方法
IT1213249B (it) * 1984-11-26 1989-12-14 Ates Componenti Elettron Processo per la fabbricazione distrutture integrate includenti celle di memoria non volatili con strati di silicio autoallineati ed associati transistori.
US4598460A (en) * 1984-12-10 1986-07-08 Solid State Scientific, Inc. Method of making a CMOS EPROM with independently selectable thresholds
US4775642A (en) * 1987-02-02 1988-10-04 Motorola, Inc. Modified source/drain implants in a double-poly non-volatile memory process
IT1225873B (it) * 1987-07-31 1990-12-07 Sgs Microelettrica S P A Catan Procedimento per la fabbricazione di celle di memoria eprom cmos con riduzione del numero di fasi di mascheratura.
US4859619A (en) * 1988-07-15 1989-08-22 Atmel Corporation EPROM fabrication process forming tub regions for high voltage devices
JPH0766946B2 (ja) * 1989-03-31 1995-07-19 株式会社東芝 半導体装置及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003511875A (ja) * 1999-10-13 2003-03-25 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド 反射防止膜を備える半導体メモリ装置を製造するための方法
JP4944328B2 (ja) * 1999-10-13 2012-05-30 スパンション エルエルシー 反射防止膜を備える半導体メモリ装置を製造するための方法
KR100666615B1 (ko) * 2004-04-14 2007-01-09 매그나칩 반도체 유한회사 플래쉬 메모리 소자

Also Published As

Publication number Publication date
DE69320582T2 (de) 1999-04-01
DE69320582D1 (de) 1998-10-01
CA2107602A1 (en) 1994-04-08
US5395778A (en) 1995-03-07
TW237564B (en, 2012) 1995-01-01
CN1086045A (zh) 1994-04-27
CN1050934C (zh) 2000-03-29
CA2107602C (en) 2004-01-20
KR100292159B1 (ko) 2001-09-17
KR940010394A (ko) 1994-05-26

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