JPH06227189A - Ｉｃカード用モジュールの製造方法 - Google Patents

Ｉｃカード用モジュールの製造方法

Info

Publication number
JPH06227189A
JPH06227189A JP5261933A JP26193393A JPH06227189A JP H06227189 A JPH06227189 A JP H06227189A JP 5261933 A JP5261933 A JP 5261933A JP 26193393 A JP26193393 A JP 26193393A JP H06227189 A JPH06227189 A JP H06227189A
Authority
JP
Japan
Prior art keywords
foil
void
chip
cavity
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP5261933A
Other languages
English (en)
Japanese (ja)
Inventor
Richard Scheuenpflug
シヨイエンプフルーク リヒアルト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPH06227189A publication Critical patent/JPH06227189A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W70/699—
    • H10W70/421—
    • H10W70/435—
    • H10W72/5449—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5261933A 1992-09-29 1993-09-24 Ｉｃカード用モジュールの製造方法 Withdrawn JPH06227189A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4232625.7 1992-09-29
DE4232625A DE4232625A1 (de) 1992-09-29 1992-09-29 Verfahren zur Montage von integrierten Halbleiterschaltkreisen

Publications (1)

Publication Number Publication Date
JPH06227189A true JPH06227189A (ja) 1994-08-16

Family

ID=6469132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5261933A Withdrawn JPH06227189A (ja) 1992-09-29 1993-09-24 Ｉｃカード用モジュールの製造方法

Country Status (4)

Country Link
EP (1) EP0591668A1 (enExample)
JP (1) JPH06227189A (enExample)
DE (1) DE4232625A1 (enExample)
TW (1) TW253072B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4427309C2 (de) * 1994-08-02 1999-12-02 Ibm Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten
DE19513797A1 (de) * 1995-04-11 1996-10-24 Siemens Ag Verfahren zum Herstellen eines Trägerelementes und Vorrichtung zur Durchführung des Verfahrens
US6072698A (en) * 1995-09-27 2000-06-06 Siemens Aktiengesellschaft Chip module with heat insulation for incorporation into a chip card
DE19535989C3 (de) * 1995-09-27 2003-03-27 Siemens Ag Chipmodul
DE19541072A1 (de) * 1995-11-03 1997-05-07 Siemens Ag Chipmodul
RU2173476C2 (ru) * 1995-11-03 2001-09-10 Сименс Акциенгезелльшафт Модуль интегральной схемы
DE19543427C2 (de) * 1995-11-21 2003-01-30 Infineon Technologies Ag Chipmodul, insbesondere zum Einbau in eine Chipkarte
DE19620025A1 (de) * 1996-05-17 1997-11-20 Siemens Ag Trägerelement für einen Halbleiterchip
JP3080175B2 (ja) 1996-05-17 2000-08-21 シーメンス アクチエンゲゼルシヤフト 半導体チップ用の支持部材
WO1998010628A1 (de) * 1996-09-05 1998-03-12 Siemens Aktiengesellschaft Trägerelement für einen halbleiterchip
DE19638371C2 (de) * 1996-09-19 2001-05-31 Siemens Ag Verfahren zur Erzeugung einer einseitigen galvanischen Metallschicht auf Chipmodulen
DE19721281C2 (de) * 1997-05-21 1999-04-01 Ods Landis & Gyr Gmbh & Co Kg Chipmodul für eine Chipkarte
FR2785072B1 (fr) * 1998-10-23 2001-01-19 St Microelectronics Sa Circuit electronique autocollant
DE19922473A1 (de) * 1999-05-19 2000-11-30 Giesecke & Devrient Gmbh Chipträgermodul
FR2957443B1 (fr) * 2010-03-12 2016-01-01 Oberthur Technologies Carte a microcircuit(s) avec contremesure pour attaques en faute par rayonnement lumineux

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
FR2579798B1 (fr) * 1985-04-02 1990-09-28 Ebauchesfabrik Eta Ag Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
FR2616995A1 (fr) * 1987-06-22 1988-12-23 Ebauchesfabrik Eta Ag Procede de fabrication de modules electroniques
FR2645680B1 (fr) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication
US5067008A (en) * 1989-08-11 1991-11-19 Hitachi Maxell, Ltd. Ic package and ic card incorporating the same thereinto

Also Published As

Publication number Publication date
EP0591668A1 (de) 1994-04-13
TW253072B (enExample) 1995-08-01
DE4232625A1 (de) 1994-03-31

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Legal Events

Date Code Title Description
A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20001128