JPH061918A - 紙質剥離用オルガノポリシロキサン組成物 - Google Patents
紙質剥離用オルガノポリシロキサン組成物Info
- Publication number
- JPH061918A JPH061918A JP5019157A JP1915793A JPH061918A JP H061918 A JPH061918 A JP H061918A JP 5019157 A JP5019157 A JP 5019157A JP 1915793 A JP1915793 A JP 1915793A JP H061918 A JPH061918 A JP H061918A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- composition
- paper
- peeling
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 41
- 239000000203 mixture Substances 0.000 title claims abstract description 35
- -1 alkenyl siloxane Chemical class 0.000 claims abstract description 39
- 239000004593 Epoxy Substances 0.000 claims abstract description 30
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000003054 catalyst Substances 0.000 claims abstract description 24
- 229910052990 silicon hydride Inorganic materials 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 239000002683 reaction inhibitor Substances 0.000 claims abstract description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 16
- 229910052697 platinum Inorganic materials 0.000 claims description 10
- 125000003700 epoxy group Chemical group 0.000 claims description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical group C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 claims description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract description 9
- 238000004873 anchoring Methods 0.000 abstract description 9
- 230000004044 response Effects 0.000 abstract description 8
- 238000001723 curing Methods 0.000 abstract description 5
- 230000007774 longterm Effects 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 2
- 238000013006 addition curing Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000008199 coating composition Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 7
- 229920002554 vinyl polymer Polymers 0.000 description 7
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000011067 equilibration Methods 0.000 description 3
- 238000006459 hydrosilylation reaction Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000005046 Chlorosilane Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- TVJPBVNWVPUZBM-UHFFFAOYSA-N [diacetyloxy(methyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(OC(C)=O)OC(C)=O TVJPBVNWVPUZBM-UHFFFAOYSA-N 0.000 description 2
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000007171 acid catalysis Methods 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229920005573 silicon-containing polymer Polymers 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- LSWYGACWGAICNM-UHFFFAOYSA-N 2-(prop-2-enoxymethyl)oxirane Chemical compound C=CCOCC1CO1 LSWYGACWGAICNM-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- XAYDWGMOPRHLEP-UHFFFAOYSA-N 6-ethenyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCCC2OC21C=C XAYDWGMOPRHLEP-UHFFFAOYSA-N 0.000 description 1
- 101100110026 Danio rerio ascl1b gene Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229920003354 Modic® Polymers 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- MFIBZDZRPYQXOM-UHFFFAOYSA-N [dimethyl-[3-(oxiran-2-ylmethoxy)propyl]silyl]oxy-dimethyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound C1OC1COCCC[Si](C)(C)O[Si](C)(C)CCCOCC1CO1 MFIBZDZRPYQXOM-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000013005 condensation curing Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 1
- STRNXFOUBFLVIN-UHFFFAOYSA-N diethyl but-2-ynedioate Chemical compound CCOC(=O)C#CC(=O)OCC STRNXFOUBFLVIN-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000012632 extractable Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 1
- 229920001558 organosilicon polymer Polymers 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Adhesive Tapes (AREA)
- Paper (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US83318092A | 1992-02-10 | 1992-02-10 | |
| US833180 | 1992-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH061918A true JPH061918A (ja) | 1994-01-11 |
Family
ID=25263677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5019157A Withdrawn JPH061918A (ja) | 1992-02-10 | 1993-02-08 | 紙質剥離用オルガノポリシロキサン組成物 |
Country Status (6)
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997029723A1 (fr) * | 1996-02-14 | 1997-08-21 | Nitto Denko Corporation | Feuille d'emballage d'article pour serviette hygienique et serviette hygienique emballee dans ladite feuille |
| JPH11172197A (ja) * | 1997-09-30 | 1999-06-29 | General Electric Co <Ge> | 印刷適性のある紙剥離組成物 |
| JP2006213816A (ja) * | 2005-02-03 | 2006-08-17 | Ge Toshiba Silicones Co Ltd | 剥離性硬化皮膜形成用シリコーン組成物 |
| CN1923939A (zh) * | 1996-10-08 | 2007-03-07 | 日立化成工业株式会社 | 半导体装置、粘合剂和粘合膜 |
| JP2008127415A (ja) * | 2006-11-17 | 2008-06-05 | Shin Etsu Chem Co Ltd | 押し出し成型用シリコーンゴム組成物及びその製造方法 |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE50103601D1 (de) | 2000-07-22 | 2004-10-21 | Goldschmidt Ag Th | Hitzestabile, korrosionsinhibierende Polyorganosiloxanharze |
| FR2903112A1 (fr) | 2006-06-29 | 2008-01-04 | Rhodia Recherches & Tech | Composition silicone reticulable pour la realisation de revetements anti-adherents pour supports souples et additif promoteur d'accrochage contenu dans cette composition |
| GB0616021D0 (en) | 2006-08-14 | 2006-09-20 | Dow Corning | Silicone release coating compositions |
| CN105517534A (zh) * | 2013-07-11 | 2016-04-20 | 莫门蒂夫性能材料股份有限公司 | 双模式固化有机硅组合物 |
| WO2018112911A1 (en) | 2016-12-23 | 2018-06-28 | Dow (Shanghai) Holding Co., Ltd. | Polyorganosiloxane release coating and method for its preparation and use |
| KR102159562B1 (ko) | 2017-10-19 | 2020-09-24 | 다우 실리콘즈 코포레이션 | 하이드로 실릴화 반응 억제제로 유용한 2-실질-1-알카인-1-사이클로헥산올을 포함하는 폴리오르가노실록산 조성물 |
| US11549039B2 (en) | 2017-10-19 | 2023-01-10 | Dow Silicones Corporation | Pressure sensitive adhesive composition and methods for its preparation and use in flexible organic light emitting diode applications |
| JP7463373B2 (ja) | 2018-12-21 | 2024-04-08 | ダウ シリコーンズ コーポレーション | 官能化ポリオルガノシロキサンの調製方法 |
| JP2022515367A (ja) | 2018-12-21 | 2022-02-18 | ダウ シリコーンズ コーポレーション | 多官能性オルガノシロキサンの製造方法及びそれを含有する組成物 |
| KR102798860B1 (ko) | 2018-12-21 | 2025-04-25 | 다우 실리콘즈 코포레이션 | 다작용성 유기실록산, 이를 함유하는 조성물, 및 이의 제조 방법 |
| EP3898776B1 (en) | 2018-12-21 | 2023-03-01 | Dow Silicones Corporation | Polyfunctional organosiloxanes, compositions containing same, and methods for the preparation thereof |
| WO2020231644A1 (en) | 2019-05-16 | 2020-11-19 | Dow Silicones Corporation | Polysiloxane controlled release additive, method for the preparation thereof, and release coating composition |
| JP7422864B2 (ja) | 2019-08-22 | 2024-01-26 | ダウ シリコーンズ コーポレーション | ポリオルガノシロキサン剥離コーティング組成物 |
| US12163049B2 (en) | 2019-09-26 | 2024-12-10 | Dow Silicones Corporation | Silicone release coating composition and methods for the preparation and use of same |
| EP4051735A4 (en) | 2019-10-30 | 2023-08-09 | Dow Silicones Corporation | POLYORGANOSILOXANE GRANULES WITHOUT SOLVENT AND PROCESS FOR THEIR PREPARATION AND USE |
| US11814554B2 (en) | 2019-10-31 | 2023-11-14 | Dow Silicones Corporation | Silicone pressure sensitive adhesive composition and methods for the preparation and use thereof |
| CN113785026B (zh) | 2019-12-02 | 2022-12-09 | 美国陶氏有机硅公司 | 用于制备防粘涂料的组合物 |
| US11279847B2 (en) | 2019-12-02 | 2022-03-22 | Dow Silicones Corporation | Composition for preparing a release coating |
| CN114729125B (zh) | 2019-12-02 | 2023-11-07 | 美国陶氏有机硅公司 | 用于制备防粘涂料的组合物 |
| EP4069764B1 (en) | 2019-12-02 | 2024-02-14 | Dow Silicones Corporation | Composition for preparing a release coating |
| EP4085113A1 (en) | 2019-12-30 | 2022-11-09 | Dow Silicones Corporation | Composition for preparing a release coating, release coating composition, and related methods |
| US20230047845A1 (en) | 2019-12-30 | 2023-02-16 | Dow Sillicones Corporation | Composition for preparing a release coating, release coating composition, and related methods |
| EP4085116A1 (en) | 2019-12-30 | 2022-11-09 | Dow Silicones Corporation | Pressure sensitive adhesive composition |
| KR102240167B1 (ko) | 2020-01-15 | 2021-04-15 | 다우 실리콘즈 코포레이션 | 실리콘 감압 접착제 조성물 및 이의 제조 및 사용 방법 |
| US20230137279A1 (en) | 2020-06-22 | 2023-05-04 | Dow Silicones Corporation | Low intensity radiation curable silicone release coating composition and method for its preparation and use |
| KR20230028305A (ko) | 2020-06-24 | 2023-02-28 | 다우 글로벌 테크놀로지스 엘엘씨 | 다관능성 오르가노실록산의 제조 방법 및 이를 함유하는 조성물 |
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| JP2025500220A (ja) | 2021-12-21 | 2025-01-09 | ダウ シリコーンズ コーポレーション | 剥離コーティング組成物 |
| CN117751174A (zh) | 2022-03-30 | 2024-03-22 | 美国陶氏有机硅公司 | 用于有机硅压敏粘合剂的可固化组合物 |
| WO2024006430A1 (en) | 2022-06-30 | 2024-01-04 | Dow Silicones Corporation | Composition for preparing a release coating |
| WO2024108429A1 (en) | 2022-11-23 | 2024-05-30 | Dow Silicones Corporation | Composition for preparing a release coating and method of preparing coated substrate |
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Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4256870A (en) * | 1979-05-17 | 1981-03-17 | General Electric Company | Solventless release compositions, methods and articles of manufacture |
| JPH0279852A (ja) * | 1988-09-16 | 1990-03-20 | Fuji Photo Film Co Ltd | 湿し水不要感光性平版印刷版 |
-
1992
- 1992-04-13 TW TW081102860A patent/TW198054B/zh active
-
1993
- 1993-01-21 CA CA002087766A patent/CA2087766A1/en not_active Abandoned
- 1993-02-08 JP JP5019157A patent/JPH061918A/ja not_active Withdrawn
- 1993-02-09 FI FI930554A patent/FI930554L/fi not_active Application Discontinuation
- 1993-02-09 KR KR1019930001732A patent/KR930017980A/ko not_active Withdrawn
- 1993-02-09 EP EP93300937A patent/EP0556023A1/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997029723A1 (fr) * | 1996-02-14 | 1997-08-21 | Nitto Denko Corporation | Feuille d'emballage d'article pour serviette hygienique et serviette hygienique emballee dans ladite feuille |
| CN1923939A (zh) * | 1996-10-08 | 2007-03-07 | 日立化成工业株式会社 | 半导体装置、粘合剂和粘合膜 |
| CN1923939B (zh) | 1996-10-08 | 2012-12-12 | 日立化成工业株式会社 | 半导体装置、粘合剂和粘合膜 |
| JPH11172197A (ja) * | 1997-09-30 | 1999-06-29 | General Electric Co <Ge> | 印刷適性のある紙剥離組成物 |
| JP2006213816A (ja) * | 2005-02-03 | 2006-08-17 | Ge Toshiba Silicones Co Ltd | 剥離性硬化皮膜形成用シリコーン組成物 |
| JP2008127415A (ja) * | 2006-11-17 | 2008-06-05 | Shin Etsu Chem Co Ltd | 押し出し成型用シリコーンゴム組成物及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| FI930554A0 (fi) | 1993-02-09 |
| FI930554A7 (fi) | 1993-08-11 |
| EP0556023A1 (en) | 1993-08-18 |
| FI930554L (fi) | 1993-08-11 |
| CA2087766A1 (en) | 1993-08-11 |
| TW198054B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-01-11 |
| KR930017980A (ko) | 1993-09-21 |
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