JPH06163782A - Ｉｃリードの曲り矯正装置 - Google Patents

Ｉｃリードの曲り矯正装置

Info

Publication number
JPH06163782A
JPH06163782A JP4331141A JP33114192A JPH06163782A JP H06163782 A JPH06163782 A JP H06163782A JP 4331141 A JP4331141 A JP 4331141A JP 33114192 A JP33114192 A JP 33114192A JP H06163782 A JPH06163782 A JP H06163782A
Authority
JP
Japan
Prior art keywords
lead
mold
die
package
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4331141A
Other languages
English (en)
Japanese (ja)
Inventor
Masaaki Wakabayashi
公明 若林
Tomio Ueno
富男 上野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Silicon Electronics Co Ltd
Original Assignee
Sanyo Silicon Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Silicon Electronics Co Ltd filed Critical Sanyo Silicon Electronics Co Ltd
Priority to JP4331141A priority Critical patent/JPH06163782A/ja
Priority to TW082109181A priority patent/TW231365B/zh
Priority to GB9322987A priority patent/GB2272392A/en
Priority to KR1019930023368A priority patent/KR0128173B1/ko
Priority to MYPI93002354A priority patent/MY108938A/en
Priority to US08/151,811 priority patent/US5477894A/en
Priority to PH47272A priority patent/PH31517A/en
Publication of JPH06163782A publication Critical patent/JPH06163782A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0092—Treatment of the terminal leads as a separate operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP4331141A 1992-11-17 1992-11-17 Ｉｃリードの曲り矯正装置 Pending JPH06163782A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP4331141A JPH06163782A (ja) 1992-11-17 1992-11-17 Ｉｃリードの曲り矯正装置
TW082109181A TW231365B (en, 2012) 1992-11-17 1993-11-03
GB9322987A GB2272392A (en) 1992-11-17 1993-11-05 Device for correcting lateral bends of IC leads
KR1019930023368A KR0128173B1 (ko) 1992-11-17 1993-11-05 아이씨(ic) 리이드의 구부러짐 교정장치
MYPI93002354A MY108938A (en) 1992-11-17 1993-11-10 Device for correcting lateral bending of ic leads.
US08/151,811 US5477894A (en) 1992-11-17 1993-11-15 Device for correcting lateral bending of IC leads
PH47272A PH31517A (en) 1992-11-17 1993-11-16 Device for correcting lateral bending of ic leads.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4331141A JPH06163782A (ja) 1992-11-17 1992-11-17 Ｉｃリードの曲り矯正装置

Publications (1)

Publication Number Publication Date
JPH06163782A true JPH06163782A (ja) 1994-06-10

Family

ID=18240334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4331141A Pending JPH06163782A (ja) 1992-11-17 1992-11-17 Ｉｃリードの曲り矯正装置

Country Status (7)

Country Link
US (1) US5477894A (en, 2012)
JP (1) JPH06163782A (en, 2012)
KR (1) KR0128173B1 (en, 2012)
GB (1) GB2272392A (en, 2012)
MY (1) MY108938A (en, 2012)
PH (1) PH31517A (en, 2012)
TW (1) TW231365B (en, 2012)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100236872B1 (ko) * 1995-09-19 2000-01-15 다니구찌 이찌로오 반도체장치의 외부리이드수정기 및 이것을 구비한 반도체장치의 외관검사장치
CN102921783A (zh) * 2012-10-29 2013-02-13 昆山市力格自动化设备有限公司 折弯机物料梭直装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2834092B2 (ja) * 1996-08-16 1998-12-09 九州日本電気株式会社 Ｉｃの外部リード成形装置および成形方法
US5826630A (en) * 1996-09-30 1998-10-27 Semiconductor Technologies & Instruments, Inc. J-lead conditioning method and apparatus
US6014993A (en) * 1998-03-27 2000-01-18 Mcms, Inc. Method and apparatus for configuring component leads
EP2025274B1 (en) 2007-08-13 2012-07-11 Gotohti.Com Inc. Touchless optically controlled dispenser
CN112705809B (zh) * 2020-12-31 2024-03-15 合肥圣达电子科技实业有限公司 一种针栅式红外探测器外壳的装架方法及装架模具

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3687172A (en) * 1970-10-07 1972-08-29 Signetics Corp Lead straightener and method
JPS58154253A (ja) * 1982-03-09 1983-09-13 Hitachi Ltd Ｉｃリ−ド矯正機構
JPS59201450A (ja) * 1983-04-28 1984-11-15 Toshiba Corp 電子部品のリ−ド矯正装置
US4643234A (en) * 1985-09-13 1987-02-17 Alpha Modular Systems Apparatus to straighten the leads of a pin grid array

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100236872B1 (ko) * 1995-09-19 2000-01-15 다니구찌 이찌로오 반도체장치의 외부리이드수정기 및 이것을 구비한 반도체장치의 외관검사장치
CN102921783A (zh) * 2012-10-29 2013-02-13 昆山市力格自动化设备有限公司 折弯机物料梭直装置
CN102921783B (zh) * 2012-10-29 2016-01-20 昆山市力格自动化设备有限公司 折弯机物料梭直装置

Also Published As

Publication number Publication date
TW231365B (en, 2012) 1994-10-01
GB9322987D0 (en) 1994-01-05
MY108938A (en) 1996-11-30
PH31517A (en) 1998-11-03
KR940012588A (ko) 1994-06-23
US5477894A (en) 1995-12-26
KR0128173B1 (ko) 1998-04-02
GB2272392A (en) 1994-05-18

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